L8G55140-PF Ligitek Group, L8G55140-PF Datasheet - Page 5

• Manufacturer Part Number: L8G55140-PF
• Manufacturer: Ligitek Group

Specifications of L8G55140-PF

• Chip Material: GaP
• Chip Peak: 565
• Lens Color: Green Diffused
• Forward Voltage(vf) Min.: 1.7
• Forward Voltage(vf) Max.: -
• Iv(mcd) Typ.: 8
• Viewing Angle 2?½: 108
• Pb: Yes
• Mounting Style: Through Hole

PART NO. L8G55140-PF
1.Iron:
Soldering Condition(Pb-Free)
2.Wave Soldering Profile
Dip Soldering
Preheat: 120° C Max
Preheat time: 60seconds Max
Ramp-up
Ramp-Down:-5° C/sec(max)
Dipping Time:3 seconds Max
Distance:2mm Min(From solder joint to body)
Solder Bath:260°C Max
2°C/sec(max)
Soldering Iron:30W Max
Temperature 350° C Max
Soldering Time:3 Seconds Max(One Time)
Distance:2mm Min(From solder joint to body)
Temp(°C)
260°
120°
25°
0° 0
60 Seconds Max
Preheat
2° /sec
max
50
LIGITEK ELECTRONICS CO.,LTD.
260° C3sec Max
Property of Ligitek Only
5° /sec
max
100
Time(sec)
150
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