L8G5230-PF/TBS-X Ligitek Group, L8G5230-PF/TBS-X Datasheet

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L8G5230-PF/TBS-X

Manufacturer Part Number
L8G5230-PF/TBS-X
Description
Manufacturer
Ligitek Group
Datasheet

Specifications of L8G5230-PF/TBS-X

Chip Material
GaP
Chip Peak
565
Lens Color
Green Diffused
Forward Voltage(vf) Min.
1.7
Forward Voltage(vf) Max.
-
Iv(mcd) Typ.
6.0
Viewing Angle 2?½
110
Pb
Yes
Mounting Style
Through Hole

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
L8G5230-PF/TBS-X
Manufacturer:
LIGITEK
Quantity:
40 000
TAPE AND BOX TYPE LED LAMPS
DOC. NO :
REV.
DATE
L8G5230-PF/TBS-X
DATA SHEET
:
:
QW0905-
A
06 - Nov.
LIGITEK ELECTRONICS CO.,LTD.
- 2007
L8G5230-PF/TBS-X
Property of Ligitek Only
Lead-Free Parts
Pb

Related parts for L8G5230-PF/TBS-X

L8G5230-PF/TBS-X Summary of contents

Page 1

... TAPE AND BOX TYPE LED LAMPS DOC REV. DATE LIGITEK ELECTRONICS CO.,LTD. L8G5230-PF/TBS-X DATA SHEET QW0905- L8G5230-PF/TBS Nov. - 2007 Property of Ligitek Only Lead-Free Parts Pb ...

Page 2

... PART NO. L8G5230-PF/TBS-X Package Dimensions L8G5230-PF 1.5MAX Note : 1.All dimension are in millimeter tolerance is ± 0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 2.0 5.0 7.0 □ 0.5 25.0MIN TYP 1.0MIN 2.54TYP + - Page 1/6 Δ H ...

Page 3

... PART NO. L8G5230-PF/TBS-X Absolute Maximum Ratings at Ta=25 Parameter Forward Current Peak Forward Current Duty 1/10@10KHz Power Dissipation Reverse Current @5V Operating Temperature Storage Temperature Typical Electrical & Optical Characteristics (Ta=25 PART NO MATERIAL Emitted GaP Green Green Diffused L8G5230-PF/TBS-X Note : 1.The forward voltage data did not including ± 0.1V testing tolerance. ...

Page 4

... PART NO. L8G5230-PF/TBS-X • Dimension Symbol Information SYMBOL ITEMS Tape Feed Hole Diameter Component Lead Pitch Front-To-Rear Deflection Feed Hole To Bottom Of Component Feed Hole To Overall Component Height Lead Length After Component Height Feed Hole Pitch Lead Location Center Of Component Location ...

Page 5

... PART NO. L8G5230-PF/TBS-X Typical Electro-Optical Characteristics Curve 8G CHIP Fig.1 Forward current vs. Forward Voltage Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature Ambient Temperature( ℃ ) Fig.5 Relative Intensity vs. Wavelength 1.0 0.5 0.0 500 550 Wavelength (nm) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Fig.2 Relative Intensity vs. Forward Current Fig.4 Relative Intensity vs. Temperature Fig.6 Directivity Radiation ° ...

Page 6

... PART NO. L8G5230-PF/TBS-X Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350° C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to body) 2.Wave Soldering Profile Dip Soldering Preheat: 120° C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5° ...

Page 7

... PART NO. L8G5230-PF/TBS-X Reliability Test: Test Item 1.Under Room Temperature Operating Life Test 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) High Temperature 1.Ta=105 Storage Test 2.t=1000 hrs (-24hrs, +72hrs) Low Temperature 1.Ta=-40 Storage Test 2.t=1000 hrs (-24hrs, +72hrs) 1.Ta=65 High Temperature 2.RH=90 %~95% High Humidity Test 3.t=240hrs 1 ...

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