LA12540-PF/TBF-X Ligitek Group, LA12540-PF/TBF-X Datasheet - Page 7

• Manufacturer Part Number: LA12540-PF/TBF-X
• Manufacturer: Ligitek Group

Specifications of LA12540-PF/TBF-X

• Chip Material: GaAsP/GaP
• Chip Peak: 592
• Lens Color: Orange Diffused
• Forward Voltage(vf) Min.: 1.7
• Forward Voltage(vf) Max.: 2.6
• Iv(mcd) Typ.: 30
• Viewing Angle 2?½: 38
• Pb: Yes
• Mounting Style: Through Hole

PART NO. LA12540-PF/TBF-X
Note: 1.Wave solder should not be made more than one time.
1.Iron:
Soldering Condition(Pb-Free)
2.Wave Soldering Profile
Dip Soldering
Preheat: 120° C Max
Preheat time: 120seconds Max
Ramp-up
Ramp-Down:-5° C/sec(max)
Dipping Time:3 seconds Max
Distance:2mm Min(From solder joint to body)
2°C/sec(max)
Solder Bath:260° C Max
Temperature 350° C Max
Soldering Time:3 Seconds Max(One time only)
Distance:2mm Min(From solder joint to body)
Soldering Iron:30W Max
2.You can just only select one of the soldering conditions as above.
Temp(° C)
260°
120°
25°
0°
0
120 Seconds Max
Preheat
2° /sec
max
100
LIGITEK ELECTRONICS CO.,LTD.
260°C3sec Max
Property of Ligitek Only
5° /sec
max
200
Time(sec)
250
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