BLM21AG601SN1

Manufacturer Part NumberBLM21AG601SN1
ManufacturerMurata
BLM21AG601SN1 datasheet
 
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Page 140/163:

Standard Soldering Conditions

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!Note
Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.
!Note
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.
Continued from the preceding page.
3. Standard Soldering Conditions
(1) Soldering Methods
Use flow and reflow soldering methods only.
Use standard soldering conditions when soldering chip
EMI suppression filters chip varistor.
In cases where several different parts are soldered, each
having different soldering conditions, use those
conditions requiring the least heat and minimum time.
(2) Soldering Temperature and Time
To prevent external electrode solder leaching and
performance deterioration, solder within the temperature
and time combinations illustrated by the slanted lines in
the following graphs. If soldering is repeated, please note
that the allowed time is the accumulated time.
Solder : H60A H63A solder(JIS Z 3238)
Flux :
o Use Rosin-based flux (when using RA type solder, clean
products sufficiently to avoid residual flux.
o Do not use strong acidic flux (with chlorine content
exceeding 0.20wt%)
o Do not use water-soluble flux.
EMIFILr (Soldering and Mounting)
oAllowable Flow Soldering Temperature and Time
280
270
w
260
e
250
r
q
240
230
0
5
10
15
20
Time [s]
q
NFE61P/H(Except NFE61HT332)
w
BLM(Except BLM03/15), BLA31
e
DLM2HG, DLP31D/S
VFM41R, NFM3DC/P, NFM41C/P,
r
NFW31S
oAllowable Reflow Soldering Temperature and Time
280
270
260
w
250
240
e
r
230
0
20
30
40
50
60
Time [s]
q
NFE31P/NFE61P/H
w
BLM/BLA
e
DLM2HG, DLP31D/S, DLP11S
NFM, NFL, NFA, NFR, HFW31S, DLW,
r
VFM41R
Continued on the following page.
C31E9.pdf 03.3.12
25
30
q
70
80
90
6
139