BU2525AF Philips Semiconductors, BU2525AF Datasheet
BU2525AF
Available stocks
Related parts for BU2525AF
BU2525AF Summary of contents
Page 1
... 8 1.1 A Csat B(end) PIN CONFIGURATION case CONDITIONS average over any 20 ms period ˚C hs CONDITIONS without heatsink compound with heatsink compound in free air 1 Product specification BU2525AF TYP. MAX. UNIT - 1500 V - 800 5 0.2 0.35 s SYMBOL ...
Page 2
... 100 mA CONDITIONS MHz 8 260 H; C Csat 1 2 B(end) B (-dI / Product specification BU2525AF MIN. TYP. MAX. UNIT - 2500 MIN. TYP. MAX. UNIT - - 1 2 1.0 mA 7.5 13.5 - ...
Page 3
... ICsat hFE 100 t IBend 0.1 t Fig.6. Typical DC current gain Product specification BU2525AF ICsat IBend t - IBM + 150 v nominal adjust for ICsat Lc LB T.U.T. Cfb BU2525AF 125 100 parameter V CE Rev 1.400 ...
Page 4
... B 4 Product specification BU2525AF VCESAT / V BU2525AF 125 sat = parameter Eoff / uJ BU2525AF 0 85˚C j Eoff = parameter kHz BU2525AF 32 kHz parameter I ...
Page 5
... 0. Fig.15. Forward bias safe operating area. T 1E+00 I & I CDC Second-breakdown limits independant of temperature Product specification BU2525AF BU2525AF 0.01 ICM 40 us ICDC 100 us Ptot 100 1000 VCE / single pulse; parameter Mounted with heatsink compound. ...
Page 6
... Fig.16. SOT199; The seating plane is electrically isolated from all terminals. Notes 1. Refer to mounting instructions for F-pack envelopes. 2. Epoxy meets UL94 V0 at 1/8". September 1997 15.3 max 3.1 3.3 7.3 6.2 5.8 3 1.2 1.0 5.45 5.45 6 Product specification BU2525AF 5.2 max 3.2 seating plane 3.5 max not tinned 0.7 max 0.4 M 2.0 Rev 1.400 o 45 ...
Page 7
... Philips customers using or selling these products for use in such applications their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. September 1997 7 Product specification BU2525AF Rev 1.400 ...