EMZ1 ON Semiconductor, EMZ1 Datasheet

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EMZ1

Manufacturer Part Number
EMZ1
Description
Manufacturer
ON Semiconductor
Datasheet

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EMZ1DXV6T1,
EMZ1DXV6T5
Product Preview
Dual General Purpose
Transistors
NPN/PNP Dual (Complimentary)
applications. It is housed in the SOT−563 which is designed for low
power surface mount applications.
1. FR−4 @ Minimum Pad.
This document contains information on a product under development. ON Semiconductor
reserves the right to change or discontinue this product without notice.
October, 2003 − Rev. P0
MAXIMUM RATINGS
THERMAL CHARACTERISTICS
Collector −Emitter Voltage
Collector −Base Voltage
Emitter −Base Voltage
Collector Current − Continuous
Total Device Dissipation
Derate above 25 C
Thermal Resistance,
Total Device Dissipation
Derate above 25 C
Thermal Resistance,
Junction and Storage
This transistor is designed for general purpose amplifier
Lead−Free Solder Plating
Low V
Semiconductor Components Industries, LLC, 2003
Junction-to-Ambient
Junction-to-Ambient
Temperature Range
(Both Junctions Heated)
(One Junction Heated)
CE(SAT)
Characteristic
Characteristic
Rating
, t0.5 V
T
T
A
A
= 25 C
= 25 C
Symbol
Symbol
Symbol
T
V
V
V
R
R
J
P
P
CEO
CBO
, T
EBO
I
qJA
qJA
C
D
D
stg
−55 to +150
(Note 1)
(Note 1)
(Note 1)
(Note 1)
(Note 1)
(Note 1)
Value
−100
−6.0
Max
Max
−60
−50
357
350
500
250
2.9
4.0
1
mW/ C
mW/ C
mAdc
Unit
Unit
Unit
mW
mW
C/W
C/W
V
V
V
C
†For information on tape and reel specifications,
EMZ1DXV6T1
EMZ1DXV6T5
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Device
Q
ORDERING INFORMATION
(4)
(3)
1
3Z = Specific Device Code
D
MARKING DIAGRAM
http://onsemi.com
= Date Code
CASE 463A
6
SOT−563
PLASTIC
SOT−563
SOT−563
Package
5 4
3Z D
(5)
Publication Order Number:
(2)
1 2
3
4000/Tape & Reel
8000/Tape & Reel
4 mm Pitch
2 mm Pitch
Shipping†
EMZ1DXV6/D
(1)
(6)
Q
2

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EMZ1 Summary of contents

Page 1

... SOT−563 4 mm Pitch 4000/Tape & Reel EMZ1DXV6T5 SOT−563 2 mm Pitch 8000/Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Publication Order Number: EMZ1DXV6/D 2 ...

Page 2

... Vdc Adc MHz Device mounted on a FR-4 glass epoxy printed circuit board using the minimum recommended footprint. 300 ms, D.C. 3. Pulse Test: Pulse Width 300 ms, D.C. 4. Pulse Test: Pulse Width EMZ1DXV6T1, EMZ1DXV6T5 ( −1.0 mAdc ...

Page 3

... CE 2 1.5 1 0.5 0 0.01 0 BASE CURRENT (mA) B Figure 3. Collector Saturation Region (V) EB Figure 5. Capacitance EMZ1DXV6T1, EMZ1DXV6T5 1000 300 mA 100 250 200 150 100 0.1 900 800 A 700 600 500 400 300 200 100 0 ...

Page 4

... 1.5 1 0.5 0 0.01 0 BASE CURRENT (mA) B Figure 3. Collector Saturation Region (V) EB Figure 5. Capacitance EMZ1DXV6T1, EMZ1DXV6T5 1000 160 mA 140 mA 120 mA 100 mA 100 0.1 900 800 A 700 600 500 400 300 200 ...

Page 5

... EMZ1DXV6T1, EMZ1DXV6T5 PACKAGE DIMENSIONS SOT−563, 6 LEAD CASE 463A− −X− −Y− 0.08 (0.003 SOLDER FOOTPRINT* 1.35 0.0531 *For information on soldering specifications, please refer to our Soldering Reference Manual, SOLDERRM/D. http://onsemi.com ISSUE A NOTES: 1 ...

Page 6

... P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com EMZ1DXV6T1, EMZ1DXV6T5 N. American Technical Support: 800−282−9855 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2− ...

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