74LCXH16245GX Fairchild Semiconductor, 74LCXH16245GX Datasheet
74LCXH16245GX
Specifications of 74LCXH16245GX
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74LCXH16245GX Summary of contents
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... Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide (Note 2) Note 1: Ordering Code “G” indicates Trays. Note 2: Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code. Logic Symbol © 2005 Fairchild Semiconductor Corporation Features 2.3V–3.6V V specifications provided CC 4 ...
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Connection Diagrams Pin Assignment for SSOP and TSSOP Pin Assignment for FBGA (Top Thru View) www.fairchildsemi.com Pin Descriptions Pin Names Description OE Output Enable Input n T/R Transmit/Receive Input n A –A Side A Inputs or 3-STATE Outputs (Bushold) 0 ...
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Absolute Maximum Ratings Symbol Parameter V Supply Voltage Input Voltage Output Voltage Input Diode Current Output Diode Current Output Source/Sink Current Supply ...
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DC Electrical Characteristics Symbol Parameter I Bushold Input Minimum I(HOLD) Drive Hold Current I Bushold Input Over-Drive I(OD) Current to Change State I 3-STATE I/O Leakage OZ I Power-Off Leakage Current OFF I Quiescent Supply Current Increase ...
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AC LOADING and WAVEFORMS FIGURE 1. AC Test Circuit (C Test PLH PZL PZH Waveform for Inverting and Non-Inverting Functions Propagation Delay. Pulse Width and t rec 3-STATE Output Low Enable ...
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Schematic Diagram Generic for LCX Family www.fairchildsemi.com 6 ...
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Physical Dimensions inches (millimeters) unless otherwise noted 54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide Package Number BGA54A 7 www.fairchildsemi.com ...
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Physical Dimensions inches (millimeters) unless otherwise noted (Continued) 48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and Fairchild reserves ...