74ABT623D,602 NXP Semiconductors, 74ABT623D,602 Datasheet
74ABT623D,602
Specifications of 74ABT623D,602
74ABT623D
935032890602
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74ABT623D,602 Summary of contents
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Octal transceiver with dual enable; non-inverting; 3-state Rev. 03 — 22 October 2009 1. General description The 74ABT623 high performance BiCMOS device combines low static and dynamic power dissipation with high speed and high output drive. The 74ABT623 is ...
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... NXP Semiconductors 3. Ordering information Table 1. Ordering information Type number Package Temperature range Name 74ABT623D +85 C 74ABT623DB +85 C 74ABT623PW + Functional diagram 1 OEAB 001aaa844 Fig 1. Logic symbol. 74ABT623_3 Product data sheet Octal transceiver with dual enable; non-inverting; 3-state Description SO20 plastic small outline package; 20 leads; body width 7.5 mm SOT163-1 SSOP20 plastic shrink small outline package ...
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... NXP Semiconductors Fig 3. Logic diagram 74ABT623_3 Product data sheet Octal transceiver with dual enable; non-inverting; 3-state 001aaa832 Rev. 03 — 22 October 2009 74ABT623 © NXP B.V. 2009. All rights reserved ...
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... NXP Semiconductors 5. Pinning information 5.1 Pinning 74ABT623 OEAB GND 10 001aak828 Fig 4. Pin configuration SO20 5.2 Pin description Table 2. Pin description Symbol Pin OEAB 18, 17, 16, 15, 14, 13, 12, 11 GND 10 OEBA Functional description [1] Table 3. Function table Input OEAB OEBA [ HIGH voltage level LOW voltage level high-impedance OFF-state. ...
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... NXP Semiconductors 7. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter V supply voltage CC V input voltage I V output voltage O I input diode current IK I output diode current OK I output current O T junction temperature j T storage temperature ...
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... NXP Semiconductors 9. Static characteristics Table 6. Static characteristics Symbol Parameter V input clamping voltage HIGH-level output OH voltage V LOW-level output OL voltage I input leakage current I I power-off leakage OFF current I power-up/power-down O(pu/pd) output current I OFF-state output OZ current I output leakage current HIGH-state output current O I supply current ...
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... NXP Semiconductors 10. Dynamic characteristics Table 7. Dynamic characteristics GND = 0 V; for test circuit, see Figure Symbol Parameter Conditions t LOW to HIGH An; see PLH propagation delay t HIGH to LOW An; see PHL propagation delay t OFF-state to HIGH OEAB, OEBA Bn; see PZH propagation delay and t OFF-state to LOW OEAB, OEBA Bn; see ...
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... NXP Semiconductors OEAB input output LOW-to-OFF OFF-to-LOW output HIGH-to-OFF OFF-to-HIGH Measurement points are given in V and V are typical voltage output levels that occur with the output load Fig 7. Enable and disable times for OEAB input. OEBA input output LOW-to-OFF OFF-to-LOW output ...
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... NXP Semiconductors negative V M pulse positive V M pulse Input pulse definition Test data and V levels are given in EXT C = Load capacitance including jig and probe capacitance. L Fig 9. Test circuit for measuring switching times Table 9. Test data Input Load 2 74ABT623_3 Product data sheet Octal transceiver with dual enable ...
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... NXP Semiconductors 12. Package outline SO20: plastic small outline package; 20 leads; body width 7 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT max. 0.3 2.45 2.65 mm 0.25 0.1 2.25 0.012 0.096 0.1 inches 0.01 0.004 0.089 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. ...
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... NXP Semiconductors SSOP20: plastic shrink small outline package; 20 leads; body width 5 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT max. 0.21 1. 0.25 0.05 1.65 Note 1. Plastic or metal protrusions of 0.2 mm maximum per side are not included. OUTLINE VERSION IEC SOT339-1 Fig 11. Package outline SOT339-1. ...
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... NXP Semiconductors TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4 pin 1 index 1 DIMENSIONS (mm are the original dimensions) A UNIT max. 0.15 0.95 mm 1.1 0.25 0.05 0.80 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. ...
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... Release date 74ABT623_3 20091022 • Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • DIP20 package removed from outline”. ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 17. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 5 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 5.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 5.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 6 Functional description . . . . . . . . . . . . . . . . . . . 4 7 Limiting values Recommended operating conditions Static characteristics Dynamic characteristics . . . . . . . . . . . . . . . . . . 7 11 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 12 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10 13 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 13 14 Revision history ...