NL17SZ125XV5T2G ON Semiconductor, NL17SZ125XV5T2G Datasheet - Page 9

• Manufacturer Part Number: NL17SZ125XV5T2G
• Description: IC BUFFER TRI-ST NON-INV SOT5535
• Manufacturer: ON Semiconductor
• Series: 17SZr

Specifications of NL17SZ125XV5T2G

• Logic Type: Buffer/Line Driver, Non-Inverting
• Number Of Elements: 1
• Number Of Bits Per Element: 1
• Current - Output High, Low: 32mA, 32mA
• Voltage - Supply: 1.65 V ~ 5.5 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: SOT-553, SOT-5
• Logic Family: LCX
• Number Of Channels Per Chip: 1
• Polarity: Non-Inverting
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 1.65 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• High Level Output Current: - 32 mA
• Low Level Output Current: 32 mA
• Maximum Power Dissipation: 150 mW
• Minimum Operating Temperature: - 40 C
• Number Of Lines (input / Output): 1 / 1
• Output Type: 3-State
• Propagation Delay Time: 5.7 ns at 3.3 V, 5 ns at 5 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

5
1
e
−X−
D
2
4
3
b
0.08 (0.003)
−Y−
5 PL
E
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
M
X
Y
0.0531
1.35
A
PACKAGE DIMENSIONS
SOLDERING FOOTPRINT*
http://onsemi.com
SOT−553, 5 LEAD
H
CASE 463B−01
c
L
E
0.0197
ISSUE B
0.0118
0.5
0.3
0.0394
1.0
9
0.0197
0.5
SCALE 20:1
NOTES:
DIM
H
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETERS
3. MAXIMUM LEAD THICKNESS INCLUDES
A
b
c
D
E
e
L
E
ANSI Y14.5M, 1982.
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
OF BASE MATERIAL.
0.0177
MIN
0.50
0.17
0.08
1.50
1.10
0.10
1.50
0.45
inches
mm
MILLIMETERS
0.50 BSC
NOM
0.55
0.22
0.13
1.60
1.20
0.20
1.60
MAX
0.60
0.27
0.18
1.70
1.30
0.30
1.70
0.020
0.007
0.003
0.059
0.043
0.004
0.059
MIN
0.020 BSC
INCHES
0.022
0.009
0.005
0.063
0.047
0.008
0.063
NOM
0.024
0.011
0.007
0.067
0.051
0.012
0.067
MAX