IC-LSOBGALS2C iC-Haus, IC-LSOBGALS2C Datasheet - Page 5

• Manufacturer Part Number: IC-LSOBGALS2C
• Description: Photosensor Package Specification
• Manufacturer: iC-Haus

iC-LS oBGA LS2C
PHOTOSENSOR PACKAGE SPECIFICATION
REVISION HISTORY
GENERAL HANDLING INSTRUCTIONS
After opening the dry pack, devices must be mounted within 8 hours (in factory conditions of maximum 30°C /
60% RH) or must be stored at <10% RH. Devices require baking before mounting if the Humidity Indicator Card
shows >10% when read at 23°C ±5°C or if the conditions mentioned above are not met. Devices may be baked
for 72 hours at 100°C using high-temperature device containers (trays).
Samples
Samples may not be subject for dry pack delivery, and, in that case, are not intended for reflow soldering.
This specification is for a newly developed product. iC-Haus therefore reserves the right to change or update, without notice, any information
contained herein, design and specification; and to discontinue or limit production or distribution of any product versions. Please contact iC-
Haus to ascertain the current data. Copying – even as an excerpt – is only permitted with iC-Haus approval in writing and precise reference
to source.
iC-Haus does not warrant the accuracy, completeness or timeliness of the specification on this site and does not assume liability for any
errors or omissions in the materials. The data specified is intended solely for the purpose of product description. No representations or
warranties, either express or implied, of merchantability, fitness for a particular purpose or of any other nature are made hereunder with
respect to information/specification or the products to which information refers and no guarantee with respect to compliance to the intended
use is given. In particular, this also applies to the stated possible applications or areas of applications of the product.
iC-Haus conveys no patent, copyright, mask work right or other trade mark right to this product. iC-Haus assumes no liability for any patent
and/or other trade mark rights of a third party resulting from processing or handling of the product and/or any other use of the product.
As a general rule our developments, IPs, principle circuitry and range of Integrated Circuits are suitable and specifically designed for
appropriate use in technical applications, such as in devices, systems and any kind of technical equipment, in so far as they do not infringe
existing patent rights. In principle the range of use is limitless in a technical sense and refers to the products listed in the inventory of goods
compiled for the 2008 and following export trade statistics issued annually by the Bureau of Statistics in Wiesbaden, for example, or to any
product in the product catalogue published for the 2007 and following exhibitions in Hanover (Hannover-Messe).
We understand suitable application of our published designs to be state-of-the-art technology which can no longer be classed as inventive
under the stipulations of patent law. Our explicit application notes are to be treated only as mere examples of the many possible and
extremely advantageous uses our products can be put to.
Rev
1
2
3
4
Notes
Initial version
Physical Dimensions/Dimension Table: Items H3, H4, M3, M4 changed from
Symmetry to Parallelism;
General Handling Instructions: RH updated from 20% to 10%;
Revision of Absolute Maximum Ratings (TG3) Reflow Soldering; Disclaimer updated;
Physical Dimensions/Dimension Table: item E1 added;
Dimension Table: Items A3, G3, L3, T1 changed
Section Lot-Code Marking added, Disclaimer updated
Correction of dimension L2
Pages affected
all
4, 5
3
Rev A4, Page 5/5