LSRF63233-PF-TBS-X Ligitek Electronics Co., Ltd., LSRF63233-PF-TBS-X Datasheet

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LSRF63233-PF-TBS-X

Manufacturer Part Number
LSRF63233-PF-TBS-X
Description
Led Lamps
Manufacturer
Ligitek Electronics Co., Ltd.
Datasheet
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
TAPE AND BOX TYPE LED LAMPS
Pb
Lead-Free Parts
LSRF63233-PF/TBS-X
DATA SHEET
DOC. NO :
QW0905-LSRF63233-PF/TBS-X
REV.
: B
DATE
:
12 - Sep. - 2008

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LSRF63233-PF-TBS-X Summary of contents

Page 1

... TAPE AND BOX TYPE LED LAMPS LSRF63233-PF/TBS-X DOC REV. DATE LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only DATA SHEET QW0905-LSRF63233-PF/TBS Sep. - 2008 Pb Lead-Free Parts ...

Page 2

... PART NO. LSRF63233-PF/TBS-X Package Dimensions LSRF63233-PF Note : 1.All dimension are in millimeter tolerance is ± 0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only R2.4 0.6 1.5MAX □ 0.5 TYP 2.54TYP - + Page Δ ...

Page 3

... PART NO. LSRF63233-PF/TBS-X Absolute Maximum Ratings at Ta=25 Parameter Forward Current Peak Forward Current Duty 1/10@10KHz Power Dissipation Reverse Current @5V Electrostatic Discharge Operating Temperature Storage Temperature * Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic glove is recommended when handing these LED. All devices, equipment and machinery must be properly grounded. Typical Electrical & ...

Page 4

... PART NO. LSRF63233-PF/TBS-X • Dimension Symbol Information SYMBOL ITEMS Tape Feed Hole Diameter Component Lead Pitch Front-To-Rear Deflection Feed Hole To Bottom Of Component Feed Hole To Overall Component Height Lead Length After Component Height Feed Hole Pitch Lead Location Center Of Component Location ...

Page 5

... PART NO. LSRF63233-PF/TBS-X Typical Electro-Optical Characteristics Curve SRF CHIP Fig.1 Forward current vs. Forward Voltage 1000 100 10 1.0 0.1 1.0 2.0 Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature 1.2 1.1 1.0 0.9 0.8 -40 - Ambient Temperature( ℃ ) Fig.5 Relative Intensity vs. Wavelength 1.0 0.5 0.0 550 600 Wavelength (nm) LIGITEK ELECTRONICS CO.,LTD. Fig.2 Relative Intensity vs. Forward Current 3 ...

Page 6

... PART NO. LSRF63233-PF/TBS-X Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to body) 2.Wave Soldering Profile Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2° C/sec(max) Ramp-Down:-5° ...

Page 7

... PART NO. LSRF63233-PF/TBS-X Reliability Test: Test Item 1.Under Room Temperature Operating Life Test 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) High Temperature 1.Ta=105 Storage Test 2.t=1000 hrs (-24hrs, +72hrs) Low Temperature 1.Ta=-40 Storage Test 2.t=1000 hrs (-24hrs, +72hrs) 1.Ta=65 High Temperature 2.RH=90 %~95% High Humidity Test 3.t=240hrs 1 ...

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