BD95371MUV ROHM Co. Ltd., BD95371MUV Datasheet - Page 4

• Manufacturer Part Number: BD95371MUV
• Description: Step Down Dc/dc Converter Controller Ic For Note Pc
• Manufacturer: ROHM Co. Ltd.

●Operation Notes
1. Absolute maximum ratings
2. Connecting the power supply connector backward
3. Power supply lines
4. GND voltage
5. Thermal design
6. Inter-pin shorts and mounting errors
7. Actions in strong electromagnetic field
8. ASO
9. Thermal shutdown circuit
10. Ground Wiring Pattern
11. Heat sink (FIN)
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc.,
can break down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit.
If any over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices,
such as fuses.
Connecting of the power supply in reverse polarity can damage IC. Take precautions when connecting the power
supply lines. An external direction diode can be added.
Design PCB layout pattern to provide low impedance GND and supply lines. To obtain a low noise ground and supply
line, separate the ground section and supply lines of the digital and analog blocks. Furthermore, for all power supply
terminals to ICs, connect a capacitor between the power supply and the GND terminal. When applying electrolytic
capacitors in the circuit, not that capacitance characteristic values are reduced at low temperatures.
The potential of GND pin must be minimum potential in all operating conditions.
Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating
conditions.
Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any
connection error or if pins are shorted together.
Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to
malfunction.
When using the IC, set the output transistor so that it does not exceed absolute maximum ratings or ASO.
The IC incorporates a built-in thermal shutdown circuit (TSD circuit). The thermal shutdown circuit (TSD circuit) is
designed only to shut the IC off to prevent thermal runaway. It is not designed to protect the IC or guarantee its
operation. Do not continue to use the IC after operating this circuit or use the IC in an environment where the operation
of this circuit is assumed.
When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns,
placing a single ground point at the ground potential of application so that the pattern wiring resistance and voltage
variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to change
the GND wiring pattern of any external components, either.
Since the heat sink (FIN) is connected with the Sub, short it to the GND.
BD95371MUV
TSD on temperature [°C] (typ.)
175
REV. A
Hysteresis temperature [°C](typ.)
15
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