SMD0805 Littelfuse, Inc., SMD0805 Datasheet
SMD0805
Manufacturer Part Number
SMD0805
Description
Polyfuse Resettable Fuses
Manufacturer
Littelfuse, Inc.
Datasheet
1.SMD0805.pdf
(2 pages)
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
SMD0805-010-24V
Manufacturer:
SEALAND/陆海
Quantity:
20 000
Part Number:
SMD0805-020-16V
Manufacturer:
SEALAND/陆海
Quantity:
20 000
Part Number:
SMD0805-050
Manufacturer:
SEALAND/陆海
Quantity:
20 000
040606
Order
Information
P
Please choose TS for SnPb and TF for Sn plating
NOTE:
I
I
V
I
hold
max
trip
max
Model
SMD0805P010TS/ TF
SMD0805P020TS/ TF
SMD0805P035TS/ TF
SMD0805P050TS/ TF
SMD0805P075TS/ TF
SMD0805P100TS/ TF
Dimensions (mm)
Permissible continuous operating current is ≤ 100 % at ambient temperature of 20 ºC (68 ºF).
SMD0805P010TS/ TF
SMD0805P020TS/ TF
SMD0805P035TS/ TF
SMD0805P050TS/ TF
SMD0805P075TS/ TF
SMD0805P100TS/ TF
=
OLYFUSE
Model
=
=
=
Hold current: maximum current device will pass without tripping in 20 °C still air.
Trip current: minimum current at which the device will trip in 20 °C still air.
Maximum voltage device can withstand without damage at rated current (I
Maximum fault current device can withstand without damage at rated voltage (V
Dimensions (mm)
SMD0805
®
R
ESETTABLE
I
(A)
hold
0.10
0.20
0.35
0.50
0.75
1.00
Qty.
Min Max
2.00
2.00
2.00
2.00
2.00
2.00
0.30
0.50
0.75
1.00
1.50
1.95
I
(A)
A
Trip
F
2.20
2.20
2.20
2.20
2.20
2.20
USES
Order-
Number
In our continuing strategy to deliver unparalleled circuit protection solutions,
technical expertise and application leadership, we proudly introduce the
V
Min
WICKMANN Group and its products to the Littelfuse portfolio.
1.20
1.20
1.20
1.20
1.20
1.20
SMD Type, 6 V / 9 V / 15V
Standard
Approvals
Features
max. dc
(V)
15
9
6
6
6
6
1.0
UL 1434 1
CSA C22.2 No. 0 CSA TIL No. CA-3A
cULus Recognition
TÜV
These devices offer wide range in hold currents
from 0.1 A to 1.0 A and voltages from 6 V to
15 V. The SMD0805 product line is suitable for
high density circuit board applications in com-
puters, cellular phone and general electronics.
Suitable for refl ow soldering.
Solder pad Layout (mm)
B
Max
1.50
1.50
1.50
1.50
1.50
1.50
max
Model
)
max
st
)
Edition
1.2
I
(A)
40
40
40
40
40
40
max.
Min Max
0.55
0.55
0.45
0.75
0.75
0.80
C
Packaging
max. time to trip
1.00
1.00
0.75
1.25
1.25
1.80
1.0
P
R
R
Caution: Operation beyond the specifi ed rating may result in damage and possible arcing and fl ame.
Specifi cations are subject to change without notice
d
(sec. @ A)
min
1max
=
1.50 @ 0.50
0.02 @ 8.00
0.10 @ 8.00
0.10 @ 8.00
0.20 @ 8.00
0.30 @ 8.00
=
=
Power dissipated from device when in the tripped state at 20 °C still air.
Minimum resistance of device in initial (un-soldered) state.
Maximum resistance of device at 20 °C measured one hour after tripping for 20 s.
1.5
Min
0.10
0.10
0.10
0.10
0.20
0.20
D
P
(W)
0.5
0.5
0.5
0.5
0.6
0.6
d max.
Specifi cations
Packaging
Materials
Max. Device Surface Temperature in Tripped State
Operating / Storage Temperature
Humidity Ageing
Vibration
Thermal Shock
Solderability
Solvent Resistance
Marking
Min
0.20
0.20
0.20
0.20
0.15
0.15
A
Terminals:
125 °C
-40 ºC to +85 ºC (consider derating)
+85 °C, 85 % R.H., 1000 hours, ± 5 % typical
resistance change
MIL-STD-883C, Method 2007.1, Condition A,
no change
MIL-STD-202F, Method 107G
+85 °C to -40 °C 20 times, -30 % typical resistance
change
Meets EIA Specifi cation RS186-9E,
ANSI/J-STD-002, Category 3
Refl ow only
MIL-STD-202, Method 215, no change
“P”, Part Code
E
R
min.
Max
1.000
0.650
0.250
0.150
0.090
0.060
0.45
0.45
0.45
0.45
0.45
0.45
(
Ω
Resistance
)
R
3.500
2.000
0.750
0.500
0.260
0.120
typ.
Blistertape and reel Ø 178 mm
Solder-plated copper
TS: Solder Material: 63/37 SnPb
TF: Solder Material: Sn
(
Ω
packaging quantity
) R
I max.
tape
4,000
4,000
4,000
3,000
3,000
2,000
6.000
3.500
1.200
0.850
0.350
0.210
www.littelfuse.com
(
Ω
)
Approvals
p
p
•
•
•
•
p
p
•
•
•
•
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SMD0805 Summary of contents
Page 1
... TÜV Features These devices offer wide range in hold currents from 0 1.0 A and voltages from The SMD0805 product line is suitable for high density circuit board applications in com- puters, cellular phone and general electronics. Suitable for refl ow soldering. Solder pad Layout (mm) 1 ...
Page 2
... Ambient Operation Temperature - I (A) hold -40 °C -20 °C 0 °C 23 °C 0.14 0.12 0.11 0.10 0.28 0.25 0.23 0.20 0.47 0.44 0.39 0.35 0.68 0.62 0.55 0.50 t.b.d. t.b.d. t.b.d. 0.75 t.b.d. t.b.d. t.b.d. 1.00 In our continuing strategy to deliver unparalleled circuit protection solutions, technical expertise and application leadership, we proudly introduce the WICKMANN Group and its products to the Littelfuse portfolio. A: SMD0805P010TS/TF B: SMD0805P020TS/TF C: SMD0805P035TS/TF D: SMD0805P050TS/TF 10.00 40 °C 50 °C 60 °C 70 °C 0.08 0.07 0.06 0.05 0.17 0.14 0.12 0.10 0.30 0.27 0.24 0.20 0.40 0.37 0.33 0.29 t.b.d. t.b.d. t.b.d. t.b.d. t.b.d. t.b.d. t.b.d. t.b.d. www.littelfuse.com 85 ° ...