MASW6010G Tyco Electronics, MASW6010G Datasheet

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MASW6010G

Manufacturer Part Number
MASW6010G
Description
Gaas Spdt Switch Dc-6 Ghz
Manufacturer
Tyco Electronics
Datasheet
1.MASW6010G.pdf (4 pages)

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Company:
Bonase Electronics (HK) Co., Limited Bonase Electronics (HK) Co., Limited
Part Number:
MASW6010G
Manufacturer:
M/A-COM
Quantity:
5 000
Company:
Meier Automation Equipment Co., Limited Meier Automation Equipment Co., Limited
Part Number:
MASW6010G
Manufacturer:
MA/COM
Quantity:
20 000
Complete
Documents
PDF
1
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
GaAs SPDT Switch
DC - 6.0 GHz
Features
Description
M/A-COM’s MASW6010G
MESFET MMIC. This part combines small size, low
insertion loss and power consumption with high
isolation. Ideal for many applications and module
use. It will function well for designs below 6 GHz.
This die includes full passivation for performance
and reliability.
Absolute Maximum Ratings
2. Exceeding any one or combination of these limits may cause
Ordering Information
1. Die quantity varies.
permanent damage to this
Low Insertion Loss: 0.5 dB Typical @ 4 GHz
Fast Switching Speed: 4 nS Typical
Ultra Low DC Power Consumption
Integral Static Protection
Operating Temperature
Control Voltage (A/B)
Storage Temperature
Part Number
MASW6010G
Input RF Power
Parameter
Expanded Features
Click Here & Upgrade
Unlimited Pages
device.
1
+42 dBm (500 MHz - 6 GHz)
Absolute Maximum
is an SPDT GaAs
-65°C to +175°C
Package
-8.5 VDC
Die
+175°C
2
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product information.
Bond Pad Dimensions
Pad Layout
Schematic
GND1, GND2
Bond Pad
RF2, RF3
DIE Size
RFC
A, B
0.031 x 0.031 x 0.010 (0.80 x 0.80 x 0.25)
Dimension Inches (mm)
0.004 x 0.004 (0.100 x 0.100)
0.004 x 0.004 (0.100 x 0.100)
0.004 x 0.004 (0.100 x 0.100)
0.012 x 0.004 (0.300 x 0.100)
MASW6010G
V5

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MASW6010G Summary of contents

Page 1

... Fast Switching Speed Typical Ultra Low DC Power Consumption Integral Static Protection Description M/A-COM’s MASW6010G MESFET MMIC. This part combines small size, low insertion loss and power consumption with high isolation. Ideal for many applications and module use. It will function well for designs below 6 GHz. ...

Page 2

... V Low Low = • North America Tel: 800.366.2266 / Fax: 978.366.2266 • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macom.com for additional data sheets and product information. MASW6010G Units Min. Typ. Max. dB — — 0.6 dB — ...

Page 3

... Isolation • North America Tel: 800.366.2266 / Fax: 978.366.2266 • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macom.com for additional data sheets and product information. MASW6010G ...

Page 4

... When hot 90/10 nitrogen/hydrogen gas is applied, solder temperature should be approximately 290° NOT expose the MASW6010G to a temperature greater than 320°C for more than 20 seconds. No more than 3 seconds of scrubbing should be required for attachment. ...

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