MTD6N20E ON Semiconductor, MTD6N20E Datasheet
MTD6N20E
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MTD6N20E Summary of contents
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... R = 460 mW DS(on) N−Channel MARKING DIAGRAMS 4 Drain 4 DPAK CASE 369C STYLE Drain Gate Source 4 4 Drain DPAK CASE 369D STYLE Gate Drain Source = Year = Work Week = Pb−Free Package ORDERING INFORMATION Publication Order Number: MTD6N20E/D ...
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... Internal Source Inductance (Measured from the source lead 0.25″ from package to source bond pad) 3. Pulse Test: Pulse Width ≤ 300 ms, Duty Cycle ≤ 2%. 4. Switching characteristics are independent of operating junction temperature. MTD6N20E (T = 25°C unless otherwise noted ...
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... Temperature 2 2.0 1.5 1.0 0.5 0 − 50 − JUNCTION TEMPERATURE (°C) J Figure 5. On−Resistance Variation with Temperature MTD6N20E 12 ≥ GATE−TO−SOURCE VOLTAGE (VOLTS) GS Figure 2. Transfer Characteristics ...
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... GSP 900 750 600 450 300 150 0 MTD6N20E POWER MOSFET SWITCHING The capacitance (C a voltage corresponding to the off−state condition when calculating t on−state when calculating t At high switching speeds, parasitic circuit elements complicate the analysis. The inductance of the MOSFET source lead, inside the package and in the circuit wiring ...
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... T )/(R ). qJC J(MAX Power MOSFET designated E−FET can be safely used in switching circuits with unclamped inductive loads. For MTD6N20E 1000 100 ...
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... DRAIN−TO−SOURCE VOLTAGE (VOLTS) DS Figure 11. Maximum Rated Forward Biased Safe Operating Area 0.5 0.2 0.1 0.1 0.05 0.02 0.01 SINGLE PULSE 0.01 1.0E−05 1.0E− Figure 14. Diode Reverse Recovery Waveform MTD6N20E SAFE OPERATING AREA 100 100 1000 STARTING JUNCTION TEMPERATURE (°C) J Figure 12 ...
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... ORDERING INFORMATION Device MTD6N20E MTD6N20E1 MTD6N20ET4 MTD6N20ET4G †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. MTD6N20E Package DPAK DPAK Straight Lead DPAK DPAK (Pb−Free) http://onsemi.com 7 † ...
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... 0.13 (0.005) M 5.80 0.228 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. MTD6N20E PACKAGE DIMENSIONS DPAK CASE 369C−01 ISSUE O SEATING −T− PLANE SOLDERING FOOTPRINT* 6 ...
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... K 0.350 0.380 8.89 9.65 R 0.180 0.215 4.45 5.45 S 0.025 0.040 0.63 1.01 V 0.035 0.050 0.89 1.27 Z 0.155 −−− 3.93 −−− STYLE 2: PIN 1. GATE 2. DRAIN 3. SOURCE 4. DRAIN ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative. MTD6N20E/D ...