ECG002B WJ Communications, Inc., ECG002B Datasheet - Page 6

• Manufacturer Part Number: ECG002B
• Description: Ingap Hbt Gain Block
• Manufacturer: WJ Communications, Inc.

WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: [phone] • e-mail: [e-mail] • Web site: www.wj.com, www.TriQuint.com
This package is lead-free/Green/RoHS-compliant. The plating material on the leads is annealed matte tin over copper. It is compatible with
both lead-free (maximum 260 °C reflow temperature) and leaded (maximum 245 °C reflow temperature) soldering processes.
ECG002
InGaP HBT Gain Block
Outline Drawing
Land Pattern
ECG002F-G Mechanical Information
Specifications and information are subject to change without notice
The component will be marked with a two-
digit numeric lot code (shown as “XX”)
followed with a “5” designator on the top
surface of the package. The obsolete tin-lead
package is marked with a two-digit numeric
lot code followed with a “1” designator; it
may also have been marked with a “10”
designator followed by a letter lot code.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
ESD Rating: Class 1A
Value:
Test:
Standard:
MSL Rating: Level 3 at +260 °C convection reflow
Standard:
1. Ground / thermal vias are critical for the proper performance of
2. Add as much copper as possible to inner and outer layers near
3. Mounting screws can be added near the part to fasten the board
4. Do not put solder mask on the backside of the PC board in the
5. RF trace width depends upon the PC board material and
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches).
Mounting Config. Notes
this device. Vias should use a .35mm (#80 / .0135”) diameter
drill and have a final plated thru diameter of .25 mm (.010”).
the part to ensure optimal thermal performance.
to a heatsink.
contacts the heatsink.
region where the board contacts the heatsink.
construction.
degrees.
Product Marking
MSL / ESD Rating
Passes between 250 and 500V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
JEDEC Standard J-STD-020
Ensure that the ground / thermal via region
Page 6 of 7 March 2008
Angles are in