ECG006 WJ Communications, Inc., ECG006 Datasheet - Page 4

• Manufacturer Part Number: ECG006
• Description: Ingap Hbt Gain Block
• Manufacturer: WJ Communications, Inc.

WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: [phone] • e-mail: [e-mail] • Web site: www.wj.com, www.TriQuint.com
This package is lead-free/Green/RoHS-compliant. The plating material on the leads is NiPdAu. It is compatible with both lead-free
ECG006
InGaP HBT Gain Block
E006G
XXXX-X
(maximum 260 °C reflow temperature) and leaded (maximum 245 °C reflow temperature) soldering processes.
Outline Drawing
Land Pattern
ECG006B-G Mechanical Information
Specifications and information are subject to change without notice
The component will be marked with an
“E006G” designator with an alphanumeric lot
code on the top surface of the package. The
obsolete tin-lead package is marked with an
“E006”
alphanumeric lot code; it may also have been
marked with a “E” designator followed by a 3-
digit numeric lot code.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
ESD Rating: Class 1A
Value:
Test:
Standard:
MSL Rating: Level 3 at +260 °C convection reflow
Standard:
1. Ground / thermal vias are critical for the proper performance of this
2. Add as much copper as possible to inner and outer layers near the
3. Mounting screws can be added near the part to fasten the board to a
4. Do not put solder mask on the backside of the PC board in the
5. RF trace width depends upon the PC board material and
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are in degrees.
Mounting Config. Notes
device. Vias should use a .35mm (#80 / .0135”) diameter drill and
have a final plated thru diameter of .25 mm (.010”).
part to ensure optimal thermal performance.
heatsink. Ensure that the ground / thermal via region contacts the
heatsink.
region where the board contacts the heatsink.
construction.
MSL / ESD Rating
Product Marking
designator
Passes between 250 and 500V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
JEDEC Standard J-STD-020
followed
Page 4 of 7 March 2008
by
an