LTC2642-16 Linear Technology Corporation, LTC2642-16 Datasheet - Page 18

• Manufacturer Part Number: LTC2642-16
• Description: Ltc2642-16 - 16-bit Vout Dac In 3mm X 3mm Dfn
• Manufacturer: Linear Technology Corporation

LTC2641/LTC2642
PACKAGE DESCRIPTION
18
3.5 ±0.05
3.50 ±0.05
2.15 ±0.05
2.15 ±0.05
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-2).
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
1.65 ±0.05
(2 SIDES)
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
ON TOP AND BOTTOM OF PACKAGE
0.25 ± 0.05
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
1.65 ±0.05
CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS OF VARIATION ASSIGNMENT
TOP AND BOTTOM OF PACKAGE
0.25 ± 0.05
(2 SIDES)
2.38 ±0.05
(2 SIDES)
2.38 ±0.05
(2 SIDES)
0.50
BSC
0.50
BSC
0.675 ±0.05
0.675 ±0.05
PACKAGE
OUTLINE
PACKAGE
OUTLINE
10-Lead Plastic DFN (3mm × 3mm)
8-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1698)
(Reference LTC DWG # 05-08-1699)
(SEE NOTE 6)
TOP MARK
TOP MARK
(NOTE 6)
PIN 1
0.200 REF
PIN 1
DD Package
0.200 REF
DD Package
3.00 ±0.10
0.75 ±0.05
(4 SIDES)
3.00 ±0.10
0.75 ±0.05
(4 SIDES)
0.00 – 0.05
0.00 – 0.05
1.65 ± 0.10
(2 SIDES)
1.65 ± 0.10
(2 SIDES)
BOTTOM VIEW—EXPOSED PAD
BOTTOM VIEW—EXPOSED PAD
0.25 ± 0.05
R = 0.115
5
R = 0.115
6
TYP
4
5
2.38 ±0.10
(2 SIDES)
2.38 ±0.10
(2 SIDES)
TYP
10
1
8
1
0.50 BSC
0.50 BSC
0.25 ± 0.05
0.38 ± 0.10
0.38 ± 0.10
(DD) DFN 1103
(DD) DFN 1203
26412f