NL17SZ74 ON Semiconductor, NL17SZ74 Datasheet - Page 6

• Manufacturer Part Number: NL17SZ74
• Description: Single D Flip Flop
• Manufacturer: ON Semiconductor

PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
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ON Semiconductor and
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
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and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
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Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
SEATING
PLANE
−T−
P
B
D
0.10 (0.004)
8
1
A
G
5
K
M
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
4
−X−
T
L
−Y−
X Y
C
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
0.0197
0.50
0.10 (0.004)
R
V
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Japan: ON Semiconductor, Japan Customer Focus Center
2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051
Phone: 81−3−5773−3850
PACKAGE DIMENSIONS
J
SOLDERING FOOTPRINT*
T
U
DETAIL E
S
http://onsemi.com
CASE 493−02
NL17SZ74
US SUFFIX
0.0394
ISSUE B
1.0
DETAIL E
US8
0.015
0.07
3.8
1.8
6
N
H
F
SCALE 8:1
R 0.10 TYP
M
inches
0.012
mm
0.30
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION “A” DOES NOT INCLUDE MOLD
4. DIMENSION “B” DOES NOT INCLUDE
5. LEAD FINISH IS SOLDER PLATING WITH
6. ALL TOLERANCE UNLESS OTHERWISE
ANSI Y14.5M, 1982.
FLASH, PROTRUSION OR GATE BURR.
MOLD FLASH. PROTRUSION AND GATE
BURR SHALL NOT EXCEED 0.140 MM
(0.0055”) PER SIDE.
INTER−LEAD FLASH OR PROTRUSION.
INTER−LEAD FLASH AND PROTRUSION
SHALL NOT E3XCEED 0.140 (0.0055”) PER
SIDE.
THICKNESS OF 0.0076−0.0203 MM.
(300−800 “).
SPECIFIED ±0.0508 (0.0002 “).
ON Semiconductor Website: http://onsemi.com
Order Literature: http://www.onsemi.com/litorder
For additional information, please contact your
local Sales Representative.
DIM
A
B
C
D
G
H
K
M
N
R
U
F
J
L
P
S
V
MILLIMETERS
MIN
1.90
2.20
0.60
0.17
0.20
0.10
0.00
3.00
0.23
0.23
0.37
0.60
0.50 BSC
0.40 REF
0.12 BSC
0
5
_
_
MAX
2.10
2.40
0.90
0.25
0.35
0.18
0.10
3.20
0.34
0.33
0.47
0.80
10
6
_
_
0.075
0.087
0.024
0.007
0.008
0.004
0.000
0.010
0.009
0.015
0.024
0.118
MIN
0.020 BSC
0.016 REF
0.005 BSC
0
5
INCHES
NL17SZ74/D
_
_
0.083
0.094
0.035
0.010
0.014
0.007
0.004
0.126
0.013
0.013
0.019
0.031
MAX
10
6
_
_