MCP73114 Microchip Technology, MCP73114 Datasheet - Page 13

• Manufacturer Part Number: MCP73114
• Description: Single-Cell Li-Ion / Li-Polymer Battery Charge Management Controller with Input Overvoltage Protection
• Manufacturer: Microchip Technology

3.0
The descriptions of the pins are listed in
TABLE 3-1:
3.1
A supply voltage of [V
recommended. Bypass to V
The V
suddenly rise of input voltage from spikes or low cost
ac-dc wall adapter.
3.2
Connect to the positive terminal of the battery. Bypass
to V
when the battery is disconnected.
3.3
No connect.
3.4
Connect to the negative terminal of the battery and
input supply.
3.5
STAT is an open-drain logic output for connection to an
LED for charge status indication in standalone
applications. Alternatively, a pull-up resistor can be
applied for interfacing to a host microcontroller. Refer to
Table 5-1
charge cycle.
© 2009 Microchip Technology Inc.
MCP73113/4
SS
DFN-10
DD
1, 2
3, 4
5, 6
8, 9
with a minimum of 1 µF to ensure loop stability
10
11
7
PIN DESCRIPTION
Battery Management Input Supply
(V
pin is rated 18V absolute maximum to prevent
Battery Charge Control Output
(V
No Connect (NC)
Battery Management 0V Reference
(V
Status Output (STAT)
for a summary of the status output during a
DD
BAT
SS
)
)
)
PIN FUNCTION TABLES
Symbol
PROG
REG
STAT
V
V
V
NC
EP
BAT
DD
SS
(Typical) + 0.3V] to 6.0V is
SS
with a minimum of 1 µF.
I/O
I/O
I/O
—
O
-
-
I
Table
Battery Management Input Supply
Battery Charge Control Output
No Connection
Battery Charge Status Output
Battery Management 0V Reference
Battery Charge Current Regulation Program and Charge Control Enable
Exposed Pad
3-1.
3.6
The fast charge current is set by placing a resistor from
PROG to V
PROG pin is rated up to 5V with 6V absolute maximum
value.
PROG pin also serves as charge control enable.
When a typical 200 kΩ impedance is applied to PROG
pin, the MCP73113/4 device is disabled until the high
impedance
“Constant Current MODE - Fast Charge” for details.
3.7
The Exposed Thermal Pad (EP) shall be connected to
the exposed copper area on the Printed Circuit Board
(PCB) for the thermal enhancement. Additional vias on
the copper area under the MCP73113/4 device can
improve the performance of heat dissipation and
simplify the assembly process.
Current Regulation Set (PROG)
Exposed Pad (EP)
Function
SS
is
during constant current (CC) mode.
removed.
MCP73113/4
Refer
www.DataSheet4U.com
DS22183B-page 13
to
Section 5.5