MCP73844 Microchip Technology, MCP73844 Datasheet - Page 16

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MCP73844

Manufacturer Part Number
MCP73844
Description
(MCP73841 - MCP73844) Advanced Single or Dual Cell Lithium-Ion/ Lithium-Polymer Charge Management Controllers
Manufacturer
Microchip Technology
Datasheet

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MCP73841/2/3/4
6.1
Due to the low efficiency of linear charging, the most
important factors are thermal design and cost, which are
a direct function of the input voltage, output current and
thermal impedance between the external P-channel
pass transistor and the ambient cooling air. The worst-
case situation occurs when the device has transitioned
from the preconditioning phase to the constant-current
phase. In this situation, the P-channel pass transistor
has to dissipate the maximum power. A trade-off must
be made between the charge current, cost and thermal
requirements of the charger.
6.1.1
Selection of the external components in Figure 6-1 are
crucial to the integrity and reliability of the charging
system. The following discussion is intended to be a
guide for the component selection process.
6.1.1.1
The preferred fast charge current for Lithium-Ion cells
is at the 1C rate, with an absolute maximum current at
the 2C rate. For example, a 500 mAh battery pack has
a preferred fast charge current of 500 mA. Charging at
this rate provides the shortest charge cycle times
without degradation to the battery pack performance or
life.
The current sense resistor (R
For the 500 mAh battery pack example, a standard
value 220 m , 1% resistor provides a typical fast
charge current of 500 mA and a maximum fast charge
current of 551 mA. Worst-case power dissipation in the
sense resistor is:
A Panasonic
resistor in a standard 0805 package is more than
sufficient for this application.
A larger value sense resistor will decrease the fast
charge current and power dissipation in both the sense
resistor and external pass transistor, but will increase
charge cycle times. Design trade-offs must be
considered to minimize space while maintaining the
desired performance.
DS21823B-page 16
PowerDissipation
Where:
I
REG
Application Circuit Design
COMPONENT SELECTION
is the desired fast charge current.
®
Sense Resistor
ERJ-6RQFR22V, 220 mW, 1%, 1/8W
R
SENSE
=
220m
=
V
------------
I
SENSE
REG
FCS
551mA
) is calculated by:
2
=
66.8mW
6.1.1.2
The external P-channel MOSFET is determined by the
gate-to-source threshold voltage, input voltage, output
voltage and fast charge current. Therefore, the
selected P-channel MOSFET must satisfy the thermal
and electrical design requirements.
Thermal Considerations
The worst-case power dissipation in the external pass
transistor occurs when the input voltage is at the
maximum and the device has transitioned from the
preconditioning phase to the constant-current phase.
In this case, the power dissipation is:
Power dissipation with a 5V, ±10% input voltage
source, 220 m , 1% sense resistor is:
Utilizing a Fairchild™ NDS8434 or an International
Rectifier IRF7404 mounted on a 1in
copper, the junction temperature rise is 75°C,
approximately. This would allow for a maximum
operating ambient temperature of 75°C.
By increasing the size of the copper pad, a higher
ambient temperature can be realized, or a lower value
sense resistor could be utilized.
Alternatively, different package options can be utilized
for more or less power dissipation. Again, design trade-
offs should be considered to minimize size while
maintaining the desired performance.
Electrical Considerations
The gate-to-source threshold voltage and R
external P-channel MOSFET must be considered in the
design phase.
The worst-case V
when the input voltage is at the minimum and the fast
charge current regulation threshold is at the maximum.
The worst-case V
Where:
V
I
V
Pow erDi ssipation
REGMAX
Po we rDissipation
DDMAX
PTHMIN
Where:
V
V
V
DRVMAX
DDMIN
FCSMAX
V
GS
is the maximum input voltage.
is the maximum fast charge current.
is the minimum transition threshold voltage.
is the minimum input voltage source
=
V
regulation threshold
is the maximum fast charge current
External Pass Transistor
is the maximum sink voltage at the
DRV
V
DR VMAX
GS
GS
output
=
=
is:
provided by the controller occurs
V DDM AX V PTHMIN
5.5V 2.75V
2004 Microchip Technology Inc.
V
DDMIN
V
551 mA
FCSMAX
2
pad of 2 oz.
DSON
I REGMAX
=
1.52W
of the

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