LX8630 Microsemi Corporation, LX8630 Datasheet - Page 2

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LX8630

Manufacturer Part Number
LX8630
Description
3a Bicmos Very Low Dropout Regulators
Manufacturer
Microsemi Corporation
Datasheet

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
LX8630-25CDD
Manufacturer:
MSC
Quantity:
20 000
Copyright
Rev. 1.0b, 2001-02-20
A
Input Voltage (V
SHDN Pin..............................................................................................-0.3V to V
Operating Junction Temperature
Storage Temperature Range ........................................................................-65 C to 150 C
Lead Temperature (Soldering, 10 seconds) ............................................................... 300 C
Note:
Junction Temperature Calculation: T
The
All of the above assume no ambient airflow.
THERMAL RESISTANCE
THERMAL RESISTANCE
THERMAL RESISTANCE
THERMAL RESISTANCE
THERMAL RESISTANCE
THERMAL RESISTANCE
THERMAL RESISTANCE
THERMAL RESISTANCE
*Tab of device attached to topside copper
0.17 sq” (110 mm
2.5 sq” (1613mm
1.0 sq” (645 mm
M I C R O S E M I
DD
DD
Plastic (P & DD Packages)................................................................................... 150 C
Copper Area
P
P
(Topside)*
JA
Exceeding these ratings could cause damage to the device. All voltages are with respect to
Ground. Currents are positive into, negative out of specified terminal.
ground plane or internal power plane
depending on mounting technique. See table below for thermal resistance
guidelines
numbers are guidelines for the thermal performance of the device/pc-board system.
2000
JA
can be improved with package soldered to 0.5IN
P
P
P
P
LASTIC
LASTIC
LASTIC
LASTIC

IN
:
                
                   
) ......................................................................................................6.5V
2
2
2
)
)
)

TO-220 3-P
TO-220 5-P
TO-263 3-P
TO-263 5-P
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
2.5 sq” (1613mm
2.5 sq” (1613mm
2.5 sq” (1613mm
-
-
-
-
-
-
-
-
          
          
JUNCTION TO
JUNCTION TO AMBIENT
JUNCTION TO
JUNCTION TO AMBIENT
JUNCTION TO
JUNCTION TO AMBIENT
JUNCTION TO
JUNCTION TO AMBIENT
Copper Area
(Backside)*
C O M P A N Y
IN
IN
IN
IN
J
= T
A
+ (P
T
T
T
T
2
2
2
.
)
)
)
AB
AB
AB
AB
D
JA
,
,
,
,
x
2.5 sq” (1613mm
2.5 sq” (1613mm
2.5 sq” (1613mm
can vary from 20°C/W to > 40°C/W
JT
JT
JT
JT
Linfinity Microelectronics Division
JA
Board Area
,
,
,
,
).

JA
JA
JA
JA
2
Microsemi
copper area over backside
  
2
2
2
)
)
)
3A BiCMOS Very Low Dropout Regulators
Resistance
Thermal
2.1 C/W
60 C/W
2.1 C/W
60 C/W
2.1 C/W
60 C/W
2.1 C/W
60 C/W
25°C/W
27°C/W
35°C/W
(
IN
JA
+0.3V
)
P
RODUCTION
D
   
   
ATA
T A B is G N D
TAB is GND
T AB is G N D
TAB is GND
D D P
S
DD P
HEET
A C K A G E
(T op V iew)
P P
P P
ACKAGE
5
4
3
2
1
(Top View)
A C K A G E
2
(Top V iew)
3
1
ACKAGE
(Top View)
5
4
3
1
(5-P
2
1
3
2
(5-P
(3-
(3-P
IN
IN
PIN
)
IN
LX8630-xx
)
V
A D J
G N D
S H D N
)
V
)
O U T
V
GND
V
IN
OUT
IN
V
AD J
G N D
SH D N
V
O U T
V
GND
IN
V
OUT
IN
Page 2

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