TPS819 Toshiba America Electronic Components, Inc., TPS819 Datasheet - Page 4

• Manufacturer Part Number: TPS819
• Description: Package Type (mm3) = Chip Type (3.2x2.4x1.1) ;; Features = Linear Output ;; Light Current Characteristics = IL=50-100uA @Ev=100 LX ;; Peak Sensitivity Wavelength = 550 ;; Applications = Illuminance Sensor
• Manufacturer: Toshiba America Electronic Components, Inc.

Handling Precautions
·
At power-on in darkness the internal circuit takes about 50 ms to stabilize. During this period the output signal
is unstable and may change. Please take this into account.
Moisture-proof Packing
(1)
(2)
(3)
Mounting Precautions
(1)
(2)
(3)
Mounting Methods
(1)
The optical characteristics of the devices may be affected by exposure to moisture in the air before
soldering and they should therefore be stored after opening the moisture proof bag under the following
conditions:
Temperature: 5°C~30°C, Humidity: 60% (max), Storage time: 168 h (max)
Please perform baking when the storage time is expired. Expiration date for an unopened moisture proof
bag is six month and 168 h for an opened moisture proof bag. This device is a tape packed product; hence,
do not bake the product at high temperature:
Recommended baking condition: Baking Temperature = 60°C, Baking Hours = 12 h or longer
The resin part is easily scratched, so avoid friction with hard materials.
When installing the assembly board in equipment, ensure that this product does not come into contact
with other components.
Reflow soldering
To avoid moisture absorption by the resin, the product is packed in an aluminum envelope with silica gel.
Do not apply stress to the resin at high temperature.
·
·
·
·
·
·
Package surface temperature: 260°C (max)
Please perform reflow soldering using the following reference temperature profile. Perform reflow
soldering no more than twice.
Please perform the first reflow soldering with reference to the above temperature profile and within
168 h of opening the package.
Second reflow soldering
In case of second reflow soldering should be performed within 168 h of the first reflow under the
above conditions.
Storage conditions before the second reflow soldering: 30°C, 60% RH max
Do not perform flow soldering.
Make any necessary soldering corrections manually.
(only once at each soldering point)
Temperature: 350°C or less
Time: within 5 s
190°C
180°C
60~120 s
Preheat
Time (s) ®
4
30~50 s
260°C max
230°C
2002-02-28
TPS819