MAX4717EUB Maxim, MAX4717EUB Datasheet - Page 2

• Manufacturer Part Number: MAX4717EUB
• Description: 4.5 /20 / 300MHz Bandwidth / Dual SPDT Analog Switches in UCSP
• Manufacturer: Maxim

ABSOLUTE MAXIMUM RATINGS
(All Voltages Referenced to GND)
V+, IN_...................................................................-0.3V to +6.0V
COM_, NO_, NC_ (Note 1) ...........................-0.3V to (V+ + 0.3V)
Continuous Current COM_, NO_, NC_ ...........................±100mA
Peak Current COM_, NO_, NC_
Continuous Power Dissipation (T
4.5 /20 , 300MHz Bandwidth, Dual SPDT
Analog Switches in UCSP
Note 1: Signals on COM_, NO_, or NC_ exceeding V+ or GND are clamped by internal diodes. Limit forward-diode current to maxi-
Note 2: This device is constructed using a unique set of packaging techniques that impose a limit on the thermal profile the device
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS—Single +3V Supply
(V+ = +2.7V to +3.6V, V
T
2
Analog Signal Range
ANALOG SWITCH (Low R
On-Resistance
(Note 5)
On-Resistance Match Between
Channels (Notes 5, 6)
On-Resistance Flatness
(Note 7)
NO_, NC_ Off-Leakage Current
(Note 8)
COM_ On-Leakage Current
(Note 8)
ANALOG SWITCH (High R
On-Resistance (Note 5)
A
(pulsed at 1ms, 10% duty cycle)................................±200mA
10-Pin µMAX (derate 5.6mW/°C above +70°C) ...........444mW
12-Bump UCSP (derate 11.4mW/°C above +70°C) ....909mW
= +25°C, unless otherwise noted.) (Notes 3, 4)
_______________________________________________________________________________________
mum current rating.
can be exposed to during board level solder attach and rework. This limit permits only the use of the solder profiles recom-
mended in the industry standard specification, JEDEC 020A, paragraph 7.6, table 3 for IR/VPR and convection reflow.
Preheating is required. Hand or wave soldering is not allowed.
PARAMETER
IH
ON
= +1.4V, V
ON
—MAX4717/MAX4718 SPDT 1)
—MAX4718 SPDT 2)
A
= +70°C)
V
R
I
I
SYMBOL
I
COM_(ON)
NO_
NO_(OFF),
NC_(OFF)
V
FLAT(ON)
IL
COM_
R
R
R
ON
ON
, V
= +0.5V, T
ON
NC_
,
V+ = 2.7V, I
V
V+ = 2.7V, I
V
V+ = 2.7V, I
V
V+ = 3.6V, V
V
V+ = 3.6V, V
V
floating
V+ = 2.7V, I
V
NO_
NO_
NO_
NO_
NO_
NO_
A
= T
or V
or V
or V
or V
or V
or V
CONDITIONS
MIN
NC_
NC_
NC_
NC_
NC_
NC_
COM_
COM_
COM_
COM_
COM_
COM_
to T
= 1.5V
= 1.5V
= 1.0V, 1.5V, 2.0V
= 3.3V, 0.3V
= 0.3V, 3.3V, or
= 1.5V
MAX
= 10mA;
= 10mA;
= 10mA;
= 10mA;
= 0.3V, 3.3V;
= 0.3V, 3.3V;
ESD Method 3015.7 .............................................................>2kV
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Bump Temperature (soldering) (Note 2)
, unless otherwise noted. Typical values are at V+ = +3.0V,
Infrared (15s) ...............................................................+220°C
Vapor Phase (60s) .......................................................+215°C
T
T
T
T
T
T
T
+25°C
+25°C
+25°C
+25°C
+25°C
+25°C
T
T
T
T
T
T
T
MIN
MIN
MIN
MIN
MIN
MIN
MIN
T
MAX
MAX
MAX
MAX
MAX
MAX
MAX
A
to
to
to
to
to
to
to
MIN
-0.5
-1
-1
-2
0
+0.01
+0.01
TYP
3.0
0.1
0.6
15
MAX
+0.5
V+
4.5
0.3
0.4
1.2
1.5
+1
+1
+2
20
25
5
UNITS
nA
nA
V