TEA1506AP Philips Semiconductors, TEA1506AP Datasheet - Page 20

• Manufacturer Part Number: TEA1506AP
• Description: GreenChip SMPS control IC
• Manufacturer: Philips Semiconductors

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dispensing. The package can be soldered after the
adhesive is cured.
Typical dwell time of the leads in the wave ranges from
3 to 4 seconds at 250 C or 265 C, depending on solder
material applied, SnPb or Pb-free respectively.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Suitability of IC packages for wave, reflow and dipping soldering methods
Notes
1. For more detailed information on the BGA packages refer to the “(LF)BGA Application Note ” (AN01026); order a copy
2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
3. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
4. These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account
5. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder
6. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction.
7. Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is definitely not
8. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than
9. Hot bar soldering or manual soldering is suitable for PMFP packages.
2003 Sep 09
4
Through-hole mount DBS, DIP, HDIP, SDIP, SIL
Through-hole-
surface mount
Surface mount
U
GreenChip II SMPS control IC
from your Philips Semiconductors sales office.
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods” .
be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature
exceeding 217 C
must be kept as low as possible.
cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,
the solder might be deposited on the heatsink surface.
The package footprint must incorporate solder thieves downstream and at the side corners.
suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
.com
MOUNTING
PMFP
BGA, LBGA, LFBGA, SQFP, SSOP-T
TFBGA, VFBGA
DHVQFN, HBCC, HBGA, HLQFP, HSQFP,
HSOP, HTQFP, HTSSOP, HVQFN, HVSON,
SMS
PLCC
LQFP, QFP, TQFP
SSOP, TSSOP, VSO, VSSOP
10 C measured in the atmosphere of the reflow oven. The package body peak temperature
(6)
(9)
, SO, SOJ
PACKAGE
DataSheet4U.com
(1)
20
(4)
M
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 C. When using a dedicated tool, all other leads can
be soldered in one operation within 2 to 5 seconds
between 270 and 320 C.
,
ANUAL SOLDERING
suitable
not suitable
not suitable
not suitable
suitable
not recommended
not recommended
(3)
TEA1506P; TEA1506AP;
WAVE
TEA1506T; TEA1506AT
(5)
SOLDERING METHOD
(6)(7)
(8)
not suitable
suitable
suitable
suitable
suitable
suitable
REFLOW
Product specification
(2)
DIPPING
suitable