PIC16C620 Microchip Technology, PIC16C620 Datasheet - Page 82

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PIC16C620

Manufacturer Part Number
PIC16C620
Description
EPROM-Based 8-Bit CMOS Microcontroller
Manufacturer
Microchip Technology
Datasheet

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PIC16C62X
12.2
DS30235G-page 82
D001
D002
D003
D004
D005
D010
D010A
D020
D023
Note 1:
Param
No.
*
2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin loading and
3: The power down current in SLEEP mode does not depend on the oscillator type. Power down current is measured with the
4: For RC osc configuration, current through Rext is not included. The current through the resistor can be estimated by the
5: The
DC CHARACTERISTICS:
V
V
V
S
V
I
I
These parameters are characterized but not tested.
Data in "Typ" column is at 5.0V, 25 C, unless otherwise stated. These parameters are for design guidance only and are not
tested.
This is the limit to which V
switching rate, oscillator type, internal code execution pattern, and temperature also have an impact on the current con-
sumption.
The test conditions for all IDD measurements in active operation mode are:
OSC1=external square wave, from rail to rail; all I/O pins tristated, pulled to V
MCLR = V
part in SLEEP mode, with all I/O pins in hi-impedance state and tied to V
formula Ir = V
base I
DD
PD
I
I
I
I
DD
DR
POR
VDD
BOR
WDT
BOR
COMP
VREF
Sym
DD
current is the additional current consumed when this peripheral is enabled. This current should be added to the
or I
DD
Standard Operating Conditions (unless otherwise stated)
Operating temperature –40˚C
Operating voltage V
Supply Voltage
RAM Data Retention
Voltage (Note 1)
V
ensure Power-on Reset
V
Power-on Reset
Brown-out Detect Voltage
Supply Current (Note 2)
Power Down Current (Note 3)
PD
; WDT enabled/disabled as specified.
DD
DD
DD
measurement.
WDT Current (Note 5)
Brown-out Reset Current
(Note 5)
Comparator Current for each
Comparator (Note 5)
V
start voltage to
rise rate to ensure
/2Rext (mA) with Rext in k .
REF
Characteristic
Current (Note 5)
DD
can be lowered in SLEEP mode without losing RAM data.
DD
range as described in DC spec Table 12-1 and Table 12-2
–40˚C
PIC16LC62X-04 (Commercial, Industrial)
0˚C
Preliminary
0.05*
Min
3.0
2.5
3.7
TA
TA
TA
+85˚C for industrial and
+70˚C for commercial and
+125˚C for extended
Typ† Max Units
1.5*
V
350
4.0
1.4
0.7
6.0
26
-
SS
425
100
300
4.3
6.0
6.0
2.5
53
15
2
V/ms See section on Power-on Reset for
DD
mA
V
V
V
V
A
A
A
A
A
A
to V
DD
,
SS
XT and RC osc configuration
LP osc configuration
Device in SLEEP mode
See section on Power-on Reset for
details
details
BOREN configuration bit is cleared
XT and RC osc configuration
F
abled (Note 4)
LP osc configuration
F
abled
V
V
BOR enabled, V
V
V
OSC
OSC
DD
DD
DD
DD
.
=3.0V, WDT disabled
=3.0V
= 3.0V
= 3.0V
= 2.0 MHz, V
= 32 kHz, V
1998 Microchip Technology Inc.
Conditions
DD
DD
DD
= 5.0V
= 3.0V, WDT dis-
= 3.0V, WDT dis-

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