NCV7708 ON Semiconductor, NCV7708 Datasheet

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NCV7708

Manufacturer Part Number
NCV7708
Description
The NCV7708 is a fully protected Hex Half Bridge Driver designed specifically for automotive and industrial motion control applications. The six low and high side drivers are freely configurable and can be controlled separately. This allows for high
Manufacturer
ON Semiconductor
Datasheet

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NCV7708
Double Hex Driver
designed specifically for automotive and industrial motion control
applications. The six low and high side drivers are freely configurable
and can be controlled separately. This allows for high side, low side,
and H−Bridge control. H−Bridge control provides forward, reverse,
brake, and high impedance states. The drivers are controlled via a
standard SPI interface.
Features
Typical Applications
*For additional information on our Pb−Free strategy and soldering details, please
© Semiconductor Components Industries, LLC, 2006
October, 2006 − Rev. 1
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
The NCV7708 is a fully protected Hex−Half Bridge−Driver
Ultra Low Quiescent Current Sleep Mode
Six Independent High−Side and Six independent Low−Side Drivers
Integrated Freewheeling Protection (LS and HS)
Configurable as H−Bridge Drivers
0.5 A Continuous (1 A peak) Current
R
5 MHz SPI Control
Compliance with 5 V and 3.3 V Systems
Overvoltage Lockout
Undervoltage Lockout
Fault Reporting
Current Limit
Over−temperature Protection
Pb−Free Packages are Available*
Automotive
Industrial
DSon
= 0.8 W (typ)
1
†For information on tape and reel specifications,
NCV7708DW
NCV7708DWG
NCV7708DWR2
NCV7708DWR2G SOIC−28W
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Device
OUTH5
OUTH4
OUTH3
OUTH2
OUTL5
OUTL4
OUTL3
OUTL2
ORDERING INFORMATION
GND
GND
GND
GND
A
WL
YY
WW
G
VS2
VS1
MARKING DIAGRAM
PIN CONNECTIONS
http://onsemi.com
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
AWLYYWWG
SOIC−28W
SOIC−28W
SOIC−28W 1000/Tape & Reel
NCV7708
1
(Pb−Free)
(Pb−Free)
Package
Publication Order Number:
DW SUFFIX
CASE 751F
SOIC−28
1000/Tape & Reel
OUTH6
OUTL6
SI
SCLK
CSB
GND
GND
GND
GND
V
SO
EN
OUTL1
OUTH1
CC
26 Units/Rail
26 Units/Rail
Shipping
NCV7708/D

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NCV7708 Summary of contents

Page 1

... NCV7708 Double Hex Driver The NCV7708 is a fully protected Hex−Half Bridge−Driver designed specifically for automotive and industrial motion control applications. The six low and high side drivers are freely configurable and can be controlled separately. This allows for high side, low side, and H− ...

Page 2

... EN ENABLE V CC BIAS POR SO SI SPI SCLK CSB VS1 Undervoltage Lockout VS2 VS1 Overvoltage Lockout VS2 NCV7708 VS1 VS CP Charge Pump Control Logic Fault Detect SPI Control Under−load Overcurrent Thermal 16 Bit Warning/Shutdown Logic and Latch ...

Page 3

... Serial Clock. Clock input for use with SPI communication Serial Input. 16 bit serial communications input. 27 OUTL6 Output Low Side 6. Open drain output driver with internal reverse diode. 28 OUTH6 Output High Side 6. Open source output driver with internal reverse diode. Drain connected to VS2. NCV7708 Description http://onsemi.com 3 ...

Page 4

... 1−oz copper, 240 mm copper area, 0.062″ thick FR4 1−oz copper, 986 mm copper area, 0.062″ thick FR4. 3. OUTLx must be protected against flyback voltages that exceed 48 V. NCV7708 Rating ) CC Test Conditions min−pad board (Note http://onsemi.com ...

Page 5

... Sink 4. Thermal characteristics are not subject to production test. 5. Production tested @ −40°C, 125°C. Refer to graph 6 for V 6. Refer to “Typical High−Side Negative Clamp Voltage Chart,” Figure 5 7. Not production tested. NCV7708 < 5. unless otherwise specified Test Conditions VS1 = VS2 = 13 ...

Page 6

... Non−Overlap Time 4. Thermal characteristics are not subject to production test. 5. Production tested @ −40°C, 125°C. Refer to graph 6 for V 6. Refer to “Typical High−Side Negative Clamp Voltage Chart,” Figure 5 7. Not production tested. NCV7708 < 5. unless otherwise specified ...

Page 7

... CSB High Time (Note 9) SO enable after CSB falling edge SO disable after CSB rising edge SO Rise Time SO Fall Time SO Valid Time 8. Not tested in production 9. This is the minimum time the user must wait between SPI commands. NCV7708 ( Timing Chart # Conditions V ...

Page 8

... Standard 16−bit communication has been implemented for the communication of this IC to turn drivers on and off, and to report faults. (Reference the SPI Communication Frame Format Diagram). The LSB (Least Significant Bit) is clocked in first. Communication is implemented as follows: NCV7708 Figure 2. SPI Timing Diagram 1 ...

Page 9

... OUTL1 OUTH1 OUTL2 OUTH2 OUTL3 OUTH3 OUTL4 SO The table below defines the programming bits and diagnostic bits. Fault information is sequentially clocked out the SO pin of the NCV7708 as programming information is clocked into the SI pin of the device. Daisy chain Input Data Bit Number Bit Description ...

Page 10

... DETAILED OPERATING DESCRIPTION General The NCV7708 Double Hex Driver provides drive capability for 3 independent H−Bridge configurations High Side configurations with 6 Low Side configurations, or any combination of arrangements. Each output drive is characterized for a 500 mA load and has a typical 1.0 A surge capability (at 12 V). Strict adherence to integrated circuit die temperature is necessary. Maximum die temperature is 150° ...

Page 11

... Bringing the CSB pin from condition immediately displays the information on the output data bit 0, thermal warning, even in the absence of a SCLK signal. As the temperature of the NCV7708 changes from a condition from below the thermal warning threshold to above the thermal warning threshold, the state of the SO pin changes and this level is available immediately when the CSB goes to 0 ...

Page 12

... Any combination of motors and high side drivers can be designed in. This allows for flexibility in many systems. H−Bridge Driver Configuration The NCV7708 has the flexibility of controlling each driver independently. When the device is set H−Bridge configuration, the software design has to take care of avoiding simultaneous activation of connected HS and LS transistors ...

Page 13

... Figure 8. qJA vs. Copper Spreader Area 100 10 1.0 0.1 0.01 0.000001 0.00001 0.0001 Figure 9. SOIC 28−Lead Single Pulse Heating Curve NCV7708 Thermal Model 1 / Symmetry 200 300 400 500 600 700 800 900 2 COPPER AREA (mm ) Cu_Area = 239 mm 0.001 ...

Page 14

... Bold face items in the Cauer network above, represent the package without the external thermal system. The Bold face items in the Foster network are computed by the square root of time constant R(t) = 28.4 * sqrt(time(sec)). The constant is derived based on the active area of the device with silicon and epoxy at the interface of the heat generation. NCV7708 0.001 0.01 ...

Page 15

... Each rung is exactly characterized by its RC−product time constant; amplitudes are the resistances. Figure 12. Non−Grounded Capacitor Thermal Ladder (“Foster” Ladder) NCV7708 circuit simulating tools, whereas Foster networks may be more easily implemented using mathematical tools (for instance spreadsheet program), according to the ...

Page 16

... PROTRUSION. ALLOWABLE DAMBER PR5OTRUSION SHALL NOT BE 0.13 TOTATL IN EXCESS OF B DIMENSION AT MAXIMUM MATERIAL CONDITION. MILLIMETERS DIM MIN MAX A 2.35 2.65 A1 0.13 0.29 B 0.35 0.49 C 0.23 0.32 D 17.80 18.05 E 7.40 7.60 G 1.27 BSC H 10.05 10.55 L 0.41 0. Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative NCV7708/D ...

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