IXDN609 Clare, Inc., IXDN609 Datasheet - Page 13

• Manufacturer Part Number: IXDN609
• Description: 9-ampere Low-side Ultrafast Mosfet Drivers
• Manufacturer: Clare, Inc.

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Clare, Inc. makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and
product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in Clare’s Standard Terms and Conditions of Sale,
Clare, Inc. assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for
a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of Clare’s product may result in direct physical harm, injury, or death to a person or severe property or environmental
damage. Clare, Inc. reserves the right to discontinue or make changes to its products at any time without notice.
R00F
5.1.5 IXD_609YI (5-LeadTO-263)
5.1.6 IXD_609PI (8-Lead DIP)
(0.240 / 0.270)
(0.015 / 0.040)
(0.100 BSC)
6.10 / 6.86
0.38 / 1.02
2.540 BSC
(0.045 / 0.065)
(0.015 / 0.023)
1.14 / 1.65
0.38 / 0.58
(0.024 / 0.039)
0.60 / 0.99
(0.346 / 0.374)
8.80 / 9.50
(0.355 / 0.400)
(0.120 / 0.150)
9.02 / 10.16
3.05 / 3.81
1 2 3 4 5
(0.380 / 0.406)
(0.039 / 0.055)
(0.295 / 0.323)
6
9.65 / 10.30
1.00 / 1.40
7.50 / 8.20
(0.125 / 0.150)
3.18 / 3.81
(0.135 / 0.185)
(0.047 / 0.067)
(0.290 / 0.325)
1.20 / 1.70
3.43 / 4.70
(0.583 / 0.622)
(0.260 / 0.283)
7.37 / 8.26
14.80 / 15.80
(0.067 BSC)
6.60 / 7.20
1.70 BSC
Optional
(0.165 / 0.189)
(0.047 / 0.055)
(0.008 / 0.015)
4.20 / 4.80
1.20 / 1.40
0.20 / 0.38
PRELIMINARY
(0.083 / 0.106)
(0.016 / 0.028)
2.10 / 2.70
0.40 / 0.70
(0.300 / 0.430)
7.62 / 10.92
(0.300 BSC)
NOTE: Molded package conforms to JEDEC standard configuration
7.62 BSC
0º - 3º
NOTES:
1. All metal surfaces are solder solder-plated except trimmed area.
2. Short lead of No. 3 is optional to IXYS.
3. No. 3 lead is connected to No. 6 lead (bottom heat sink) internally.
MS-001 variation BA.
(0.088 / 0.112)
2.24 / 2.84
(inches MIN / inches MAX)
mm MIN / mm MAX
Dimensions
(0.144)
(0.250)
3.65
6.35
(8-0.035 DIA.)
8-0.900 DIA.
(0.067)
Recommended PCB Pattern
1.70
(0.055)
1.40
(inches MIN / inches / MAX)
(0.409)
Specification: DS-IXD_609-R00F
©Copyright 2010, Clare, Inc.
All rights reserved. Printed in USA.
8/24/2010
PC Board Pattern
10.40
mm MIN / mm MAX
DIMENSIONS
(0.360)
(0.152)
(0.041)
9.15
3.85
1.05
(0.100)
2.540
(0.295)
7.50
IXD_609
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