TSSOP STATS ChipPAC, TSSOP Datasheet
TSSOP
Manufacturer Part Number
TSSOP
Description
Small Outline Packages
Manufacturer
STATS ChipPAC
Datasheet
1.TSSOP.pdf
(2 pages)
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Price
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Part Number:
TSSOP30E19.7T-DE-D
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AMP
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Part Number:
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TSSOP
www.statschippac.com
FEATURES
TSSOP
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MSOP
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APPLICATIONS
• Analog and Operation Amplifiers
• Controllers and Drivers
• Logic, Memory, and RF/Wireless
• Disk drives, video/audio and consumer electronics/
Small Outline Packages
• • • • • Wide range of body sizes
• • • • • 8 to 56 lead counts
• • • • • Thermally enhanced versions
Body Size: 3.0 x 4.4mm to 14.0 x 6.1mm
Thermal Enhancements: ep (exposed pad)
Body Size: 3 x 3mm
Lead Pitch: 0.65mm (8L) and 0.50mm (10L)
Thermal enhancements: ep (exposed pad)
Lead Count: 8L to 56L
Lead Pitch: 0.50mm & 0.65mm
Package Height: 1.20mm max.
JEDEC standard compliant (MO-153)
Lead-free (Pb-free) and Green
Lead Count: 8L & 10L
Lead-free (Pb-free) and Green
JEDEC standard compliant
appliances
available (TSSOP-ep and
MSOP-ep)
and
MSOP
DESCRIPTION
Package (SOP) families including TSSOP, TSSOP-ep, and MSOP.
STATS ChipPAC’s TSSOP (Thin Shrink Small Outline Package) is
suitable for applications requiring a thin profile. TSSOP is a
leadframe based, plastic encapsulated package with gull wing
shaped leads on two sides with lead count ranging from 8 to
56 leads. The ultra thin TSSOP is made possible by optimal wire
looping control during the wire bonding process as well as
optimal package warpage control during the molding process.
TSSOP is designed to fill the niche of low pin count devices
where low profile and small footprint are key design consider-
ations. The TSSOP features 0.5 and 0.65mm lead pitch, and is
ideal for low pin count analog and mixed signal devices in
handheld applications such as PDAs and mobile / cellular
phones.
step further, STATS ChipPAC offers a Micro Small Outline
Package (MSOP) for applications requiring thin, small, and
high reliability. This smaller package offers a smaller footprint,
shorter wires for improved electrical connections, and better
moisture reliability (MRT/MSL).
offers thermally enhanced “ep” versions featuring an exposed
die paddle for efficient heat dissipation. The exposed die
attach pad design of the TSSOP package can provide excellent
thermal dissipation by soldering the copper die attach pad
directly onto the PCB, and is ideal for low pin count analog and
mixed signal devices.
state of the art design and simulation tools to achieve
optimum electrical and thermal performance. STATS ChipPAC’s
state of the art assembly facility and proven materials assure
high yield manufacturing and long term reliability.
Taking the reliability of Small Outline Packages (SOP) one
In addition to standard TSSOP and MSOP, STATS ChipPAC
STATS ChipPAC uses the latest leadframe technology and
STATS ChipPAC offers a complete line of Small Outline
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Datasheet:
TSSOP Summary of contents
Page 1
... TSSOP is designed to fill the niche of low pin count devices where low profile and small footprint are key design consider- ations. The TSSOP features 0.5 and 0.65mm lead pitch, and is ...
Page 2
... SPECIFICATIONS (TSSOP) Die Thickness 9-11mil range preferred (TSSOP) 6-16mil range preferred (TSSOP-ep) Gold Wire 20 m (0.8mils) diameter, 99.99% Au Lead Finish Sn/Pb (85/15%) or Matte Tin Marking Laser Packing Options Tube SPECIFICATIONS (MSOP) Die Thickness 6-9mil range preferred Gold Wire 20 m (0.8mils) diameter, 99.99% Au Lead Finish Sn/Pb (85/15%) or Matte Tin ...