MC10H136 ON Semiconductor, MC10H136 Datasheet - Page 7

• Manufacturer Part Number: MC10H136
• Description: Universal Hexadecimal Counter
• Manufacturer: ON Semiconductor

16
C
1
K
H
N
B
B
−A−
G
16
1
F
D
9
8
16 PL
E
F
0.25 (0.010)
B
S
A
G
0.25 (0.010)
K
C
M
−T−
T
A
9
8
SEATING
PLANE
PACKAGE DIMENSIONS
M
M
16X
CERAMIC DIP PACKAGE
PLASTIC DIP PACKAGE
T
http://onsemi.com
D
A
A
T
CASE 620A−01
J
CASE 648−08
SEATING
PLANE
L SUFFIX
P SUFFIX
CDIP−16
ISSUE O
PDIP−16
ISSUE R
L
7
L
0.25 (0.010)
M
16X
M
T
M
J
B
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
Y14.5M, 1982.
FORMED PARALLEL.
DIM
M
A
B
C
D
G
H
K
S
F
J
L
0.740
0.250
0.145
0.015
0.040
0.008
0.110
0.295
0.020
MIN
0.100 BSC
0.050 BSC
0
NOTES:
INCHES
_
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
5 THIS DRAWING REPLACES OBSOLETE
ASME Y14.5M, 1994.
FORMED PARALLEL.
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
CASE OUTLINE 620−10.
0.770
0.270
0.175
0.021
0.015
0.130
0.305
0.040
MAX
DIM
0.70
M
10
A
B
C
D
E
F
G
H
K
L
N
_
0.750
0.240
0.015
0.055
0.008
0.125
0.020
MIN
18.80
−−−
MILLIMETERS
0.050 BSC
0.100 BSC
0.300 BSC
MIN
6.35
3.69
0.39
1.02
0.21
2.80
7.50
0.51
0
INCHES
2.54 BSC
1.27 BSC
_
0
_
0.785
0.295
0.200
0.020
0.065
0.015
0.170
0.040
MAX
19.55
MAX
15
6.85
4.44
0.53
1.77
0.38
3.30
7.74
1.01
10
_
_
19.05
MILLIMETERS
MIN
6.10
0.39
1.40
0.21
3.18
0.51
−−−
1.27 BSC
2.54 BSC
7.62 BSC
0
_
19.93
MAX
7.49
5.08
0.50
1.65
0.38
4.31
1.01
15
_