MJD32 ON Semiconductor, MJD32 Datasheet

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MJD32

Manufacturer Part Number
MJD32
Description
(MJD31 / MJD32) Complementary Power Transistors
Manufacturer
ON Semiconductor
Datasheet

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MJD31, MJD31C (NPN),
MJD32, MJD32C (PNP)
Complementary Power
Transistors
DPAK For Surface Mount Applications
applications.
Features
*These ratings are applicable when surface mounted on the minimum pad sizes
© Semiconductor Components Industries, LLC, 2005
June, 2005 − Rev. 6
MAXIMUM RATINGS
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits
are exceeded, device functional operation is not implied, damage may occur
and reliability may be affected.
THERMAL CHARACTERISTICS
recommended.
Collector−Emitter Voltage
Collector−Base Voltage
Emitter−Base Voltage
Collector Current − Continuous
Base Current
Total Power Dissipation @ T
Total Power Dissipation @ T
Operating and Storage Junction
Thermal Resistance, Junction−to−Case
Thermal Resistance, Junction−to−Ambient*
Lead Temperature for Soldering Purposes
Designed for general purpose amplifier and low speed switching
Lead Formed for Surface Mount Applications in Plastic Sleeves
Straight Lead Version in Plastic Sleeves (“1” Suffix)
Lead Formed Version in 16 mm Tape and Reel (“T4” Suffix)
Electrically Similar to Popular TIP31 and TIP32 Series
Epoxy Meets UL 94, V−0 @ 0.125 in
ESD Ratings: Human Body Model, 3B u 8000 V
Pb−Free Packages are Available
Derate above 25°C
Derate above 25°C
Temperature Range
Characteristic
MJD31C and MJD32C are Preferred Devices
Machine Model, C u 400 V
− Peak
Rating
MJD31C, MJD32C
MJD31C, MJD32C
MJD31, MJD32
MJD31, MJD32
A
C
= 25°C
= 25°C
Symbol
Symbol
T
V
R
J
R
V
V
P
P
CEO
, T
T
I
I
qJC
qJA
CB
EB
C
B
D
D
L
stg
−65 to
0.012
+ 150
Max
0.12
1.56
Max
100
100
260
8.3
40
40
15
80
5
3
5
1
1
W/°C
W/°C
°C/W
°C/W
Unit
Unit
Vdc
Vdc
Vdc
Adc
Adc
°C
°C
W
W
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
Preferred devices are recommended choices for future use
and best overall value.
1 2
1
2
3
3
POWER TRANSISTORS
ORDERING INFORMATION
40 AND 100 VOLTS
4
4
http://onsemi.com
Y
WW
xx
G
3 AMPERES
CASE 369C
CASE 369D
15 WATTS
STYLE 1
STYLE 1
DPAK−3
SILICON
DPAK
Publication Order Number:
= Year
= Work Week
= 1, 1C, 2, or 2C
= Pb−Free Package
DIAGRAMS
MARKING
J3xxG
J3xxG
MJD31/D
YWW
YWW

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MJD32 Summary of contents

Page 1

... MJD31, MJD31C (NPN), MJD32, MJD32C (PNP) MJD31C and MJD32C are Preferred Devices Complementary Power Transistors DPAK For Surface Mount Applications Designed for general purpose amplifier and low speed switching applications. Features • Lead Formed for Surface Mount Applications in Plastic Sleeves • ...

Page 2

... MJD31, MJD31C (NPN), MJD32, MJD32C (PNP) Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î ELECTRICAL CHARACTERISTICS Î ...

Page 3

... MJD31, MJD31C (NPN), MJD32, MJD32C (PNP 2 1 (SURFACE MOUNT 0 100 T, TEMPERATURE (°C) Figure 1. Power Derating 500 300 T = 150°C J 25°C 100 70 −55 ° 0.03 0.05 0.07 0.1 0.3 0.5 0 COLLECTOR CURRENT (AMPS) C Figure 3. DC Current Gain 1 ...

Page 4

... MJD31, MJD31C (NPN), MJD32, MJD32C (PNP 1.2 0.8 0 BASE CURRENT (mA) B Figure 7. Collector Saturation Region 1 0 0.5 0.5 0.3 0.2 0.2 0.1 0.05 0.1 0.07 0.01 0.05 0.03 SINGLE PULSE 0.02 0.01 0.01 0.02 0.03 0.05 0.1 0.2 0 0.5 WIRE BOND LIMIT THERMAL LIMIT 0.3 0.2 SECOND BREAKDOWN LIMIT CURVES APPLY BELOW RATED V 0.1 CEO T = 25°C SINGLE PULSE C 0 ...

Page 5

... MJD31, MJD31C (NPN), MJD32, MJD32C (PNP) ORDERING INFORMATION Device MJD31C MJD31CG MJD31C1 MJD31C1G MJD31CRL MJD31CRLG MJD31CT4 MJD31CT4G MJD31T4 MJD31T4G MJD32C MJD32CG MJD32C1 MJD32C1G MJD32CRL MJD32CRLG MJD32CT4 MJD32CT4G MJD32RL MJD32RLG MJD32T4 MJD32T4G †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D ...

Page 6

... MJD31, MJD31C (NPN), MJD32, MJD32C (PNP 0.13 (0.005) M 5.80 0.228 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. PACKAGE DIMENSIONS DPAK CASE 369C ...

Page 7

... MJD31, MJD31C (NPN), MJD32, MJD32C (PNP −T− SEATING K PLANE 0.13 (0.005) M PACKAGE DIMENSIONS DPAK−3 CASE 369D−01 ISSUE http://onsemi.com 7 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. ...

Page 8

... MJD31, MJD31C (NPN), MJD32, MJD32C (PNP) ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “ ...

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