BYW96 Philips Semiconductors, BYW96 Datasheet - Page 3

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BYW96

Manufacturer Part Number
BYW96
Description
Fast soft-recovery controlled avalanche rectifiers
Manufacturer
Philips Semiconductors
Datasheet

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Philips Semiconductors
ELECTRICAL CHARACTERISTICS
T
THERMAL CHARACTERISTICS
Note
1. Device mounted on an epoxy-glass printed-circuit board, 1.5 mm thick; thickness of Cu-layer 40 m, see Fig.11.
1996 Jun 07
SYMBOL
V
V
I
t
C
SYMBOL
R
R
j
R
rr
dI
--------
F
(BR)R
= 25 C unless otherwise specified.
d
dt
th j-tp
th j-a
Fast soft-recovery
controlled avalanche rectifiers
R
For more information please refer to the “General Part of associated Handbook” .
forward voltage
reverse avalanche
breakdown voltage
reverse current
reverse recovery time
diode capacitance
maximum slope of
reverse recovery current
thermal resistance from junction to tie-point
thermal resistance from junction to ambient
BYW96D
BYW96E
PARAMETER
PARAMETER
I
I
I
V
see Fig.9
V
see Fig.9
when switched from I
to I
I
f = 1 MHz; V
when switched from I
V
see Fig.13
F
F
R
R
R
R
R
= 5 A; T
= 5 A; see Fig.8
= 0.1 mA
= 0.25 A; see Fig.12
R
= V
= V
= 1 A; measured at
30 V and dI
RRMmax
RRMmax
CONDITIONS
j
= T
R
;
; T
= 0 V; see Fig.10
j max
j
F
= 165 C;
/dt = 1 A/ s;
3
; see Fig.8
F
F
= 0.5 A
= 1 A to
lead length = 10 mm
note 1
1100
MIN.
900
CONDITIONS
TYP.
75
BYW96 series
Product specification
VALUE
150
300
MAX.
1.25
1.50
25
75
1
6
V
V
V
V
ns
pF
A/ s
A
A
UNIT
UNIT
K/W
K/W

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