IRF1010ES International Rectifier, IRF1010ES Datasheet

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IRF1010ES

Manufacturer Part Number
IRF1010ES
Description
Power MOSFET(Vdss=60V/ Rds(on)=12mohm/ Id=84A)
Manufacturer
International Rectifier
Datasheet

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IRF1010ESTRLPBF
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l
l
l
l
l
l
Description
Absolute Maximum Ratings
Thermal Resistance
Advanced HEXFET
Rectifier utilize advanced processing techniques to
achieve extremely low on-resistance per silicon area.
This benefit, combined with the fast switching speed and
ruggedized device design that HEXFET power MOSFETs
are well known for, provides the designer with an
extremely efficient and reliable device for use in a wide
variety of applications.
The D
accommodating die sizes up to HEX-4. It provides the
highest power capability and the lowest possible on-
resistance in any existing surface mount package. The
D
low internal connection resistance and can dissipate up to
2.0W in a typical surface mount application.
The through-hole version (IRF1010EL) is available for low-
profile applications.
www.irf.com
I
I
I
P
V
I
E
dv/dt
T
T
R
R
D
D
DM
AR
2
J
STG
D
GS
AR
Pak is suitable for high current applications because of its
@ T
@ T
JC
JA
Advanced Process Technology
Surface Mount (IRF1010ES)
Low-profile through-hole (IRF1010EL)
175°C Operating Temperature
Fast Switching
Fully Avalanche Rated
@T
2
C
C
C
Pak is a surface mount power package capable of
= 25°C
= 100°C
= 25°C
®
Continuous Drain Current, V
Continuous Drain Current, V
Pulsed Drain Current
Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
Avalanche Current
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
Operating Junction and
Storage Temperature Range
Soldering Temperature, for 10 seconds
Mounting torque, 6-32 or M3 srew
Junction-to-Case
Junction-to-Ambient (PCB mount)**
Power MOSFETs from International
Parameter
Parameter


ƒ
GS
GS

@ 10V
@ 10V
G
Typ.
300 (1.6mm from case )
–––
–––
10 lbf•in (1.1N•m)
HEXFET
-55 to + 175
IRF1010ES
S
D
D
Max.
84
330
200
± 20
1.4
4.0
59
50
17
2
Pak
®
IRF1010ES
IRF1010EL
R
Power MOSFET
DS(on)
Max.
V
0.75
I
40
D
DSS
= 84A‡
IRF1010EL
TO-262
PD - 91720
= 60V
= 12m
Units
Units
°C/W
W/°C
V/ns
mJ
°C
W
A
V
A
02/14/02
1

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IRF1010ES Summary of contents

Page 1

... Advanced Process Technology l l Surface Mount (IRF1010ES) Low-profile through-hole (IRF1010EL) l 175°C Operating Temperature l l Fast Switching Fully Avalanche Rated l Description ® Advanced HEXFET Power MOSFETs from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ...

Page 2

... IRF1010ES/IRF1010EL Electrical Characteristics @ T Parameter V Drain-to-Source Breakdown Voltage (BR)DSS Breakdown Voltage Temp. Coefficient (BR)DSS J R Static Drain-to-Source On-Resistance DS(on) V Gate Threshold Voltage GS(th) g Forward Transconductance fs I Drain-to-Source Leakage Current DSS Gate-to-Source Forward Leakage I GSS Gate-to-Source Reverse Leakage Q Total Gate Charge ...

Page 3

... Drain-to-Source Voltage (V) DS Fig 1. Typical Output Characteristics 1000  ° 100  V DS 20µs PULSE WIDTH Gate-to-Source Voltage (V) GS Fig 3. Typical Transfer Characteristics www.irf.com IRF1010ES/IRF1010EL  1000 TOP BOTTOM 100 ° 10 0.1 10 100 Fig 2. Typical Output Characteristics 3 2.5 2.0  ° 175 C J 1.5 1.0 ...

Page 4

... IRF1010ES/IRF1010EL 6000 0V, C iss = rss = C gd 5000 C oss = Ciss 4000 3000 Coss 2000 Crss 1000 Drain-to-Source Voltage (V) Fig 5. Typical Capacitance Vs. Drain-to-Source Voltage 1000 100  ° 175 ° 0.1 0.0 0.6 1.2 V ,Source-to-Drain Voltage (V) SD Fig 7 ...

Page 5

... Case Temperature 0.50 0.20 0.1 0.10 0.05  SINGLE PULSE 0.02 (THERMAL RESPONSE) 0.01 0.01 0.00001 0.0001 Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Case www.irf.com IRF1010ES/IRF1010EL R G Pulse Width Duty Factor Fig 10a. Switching Time Test Circuit V DS 90% 150 175 ° 10 d(on) Fig 10b. Switching Time Waveforms ...

Page 6

... IRF1010ES/IRF1010EL Fig 12a. Unclamped Inductive Test Circuit Fig 12b. Unclamped Inductive Waveforms Charge Fig 13a. Basic Gate Charge Waveform 6 800 ...

Page 7

... Reverse Polarity of D.U.T for P-Channel Driver Gate Drive D.U.T. I Reverse Recovery Current D.U.T. V Re-Applied Voltage Inductor Curent *** V Fig 14. For N-channel www.irf.com IRF1010ES/IRF1010EL Peak Diode Recovery dv/dt Test Circuit + Circuit Layout Considerations * Low Stray Inductance Ground Plane ƒ Low Leakage Inductance Current Transformer - - dv/dt controlled controlled by Duty Factor "D" ...

Page 8

... IRF1010ES/IRF1010EL 2 D Pak Package Outline 1 0.54 (.4 15) 1 0.29 (.4 05) 1.4 0 (.055 ) - AX. 2 1 (.6 10) 1 (.5 80 1.40 (.0 55) 3X 1.14 (.0 45) 0 .93 (. .69 (. .08 (. .25 (. FTER IP. ...

Page 9

... TO-262 Package Outline TO-262 Part Marking Information www.irf.com IRF1010ES/IRF1010EL 9 ...

Page 10

... IRF1010ES/IRF1010EL 2 D Pak Tape & Reel Information TIO . -418 . LIN SIO LIM ...

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