BU2523AF Philips Semiconductors, BU2523AF Datasheet
BU2523AF
Related parts for BU2523AF
BU2523AF Summary of contents
Page 1
... kHz kHz Csat PIN CONFIGURATION case CONDITIONS average over any 20 ms period ˚C hs CONDITIONS with heatsink compound in free air 1 Product specification BU2523AF TYP. MAX. UNIT - 1500 V - 800 5 0.15 0.3 s ...
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... CONDITIONS 200 H; C Csat C V 145 0. B(end 0 ICsat end Fig.2. Switching times definitions. 2 Product specification BU2523AF MIN. TYP. MAX. UNIT - 2500 MIN. TYP. MAX. UNIT - - 1 2 1.0 mA 7.5 13 800 ...
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... Product specification BU2523AF BU2523AF/X Ths = 25 C Ths = 85 C IC/ IC/ sat = parameter BU2523AF/X Ths = 25 C Ths = 4 sat = parameter BU2523AF/DF/AX/DX Ths = 25 C Ths = 85 C 0 Fig.8. Typical losses. ...
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... LC LB T.U.T. = 150 1.5 mH 1450 0. B(end) 1000 VCE / V BU2523AF/ frequency (kHz) during normal running vs. frequency of Csat operation for optimum performance VCL CFB BU2523 Area where fails occur 1500 T j jmax 80 Rev 1 ...
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... Fig.15. SOT199; The seating plane is electrically isolated from all terminals. Notes 1. Refer to mounting instructions for F-pack envelopes. 2. Epoxy meets UL94 V0 at 1/8". September 1997 15.3 max 3.1 3.3 7.3 6.2 5.8 3 1.2 1.0 5.45 5.45 5 Product specification BU2523AF 5.2 max 3.2 seating plane 3.5 max not tinned 0.7 max 0.4 M 2.0 Rev 1.100 o 45 ...
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... Philips customers using or selling these products for use in such applications their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. September 1997 6 Product specification BU2523AF Rev 1.100 ...