TDA1310 Philips Semiconductors, TDA1310 Datasheet

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TDA1310

Manufacturer Part Number
TDA1310
Description
Stereo Continuous Calibration DAC CC-DAC
Manufacturer
Philips Semiconductors
Datasheet

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Philips Semiconductors
Preliminary specification
Supersedes data of TDA1310; TDA1310T July 1993
File under Integrated Circuits, IC01
DATA SHEET
TDA1310A
Stereo Continuous Calibration DAC
(CC-DAC)
INTEGRATED CIRCUITS
May 1994

Related parts for TDA1310

TDA1310 Summary of contents

Page 1

... DATA SHEET TDA1310A Stereo Continuous Calibration DAC (CC-DAC) Preliminary specification Supersedes data of TDA1310; TDA1310T July 1993 File under Integrated Circuits, IC01 Philips Semiconductors INTEGRATED CIRCUITS May 1994 ...

Page 2

... This duplication is based upon an internal charge storage principle having an accuracy insensitive to ageing, temperature and process variations. The TDA1310A is fabricated in a 1.0 m CMOS process and features an extremely low power dissipation, small package size and easy application. Furthermore, the accuracy of the intrinsic high coarse-current combined ...

Page 3

... A-weighted signal level; A-weighted (see Fig.1 A-weighted at code 0000H A-weighted mA see Fig code 0000H code 0000H DD 3 Preliminary specification TDA1310A MIN. TYP. MAX. 3 5.0 5.5 3.0 4.0 0.9 1.0 1.1 0 0.05 0. ...

Page 4

Fig.1 Block diagram. ...

Page 5

... OUT ref terminal. The 32 current sources and the spare current source of the TDA1310A are continuously calibrated (see Fig.1). The spare current source is included to allow continuous converter operation. The output of one calibrated source is connected to an 11-bit binary current divider consisting of 2048 transistors ...

Page 6

... Machine model 200 pF 0 zaps positive and negative. THERMAL CHARACTERISTICS SYMBOL R thermal resistance from junction to ambient in free air th j-a DIL8 SO8 May 1994 a. Fig.3 Calibration principle. PARAMETER PARAMETER 6 Preliminary specification TDA1310A b. CONDITIONS MIN. MAX +150 +150 40 +85 note 1 2000 +2000 note 2 ...

Page 7

... G reference input current to full FS scale output current gain G reference input current to bias bias current gain May 1994 CONDITIONS at code 0000H see Fig Preliminary specification TDA1310A MIN. TYP. MAX. 3.0 5.0 5.5 3.0 4 18.4 18.4 384 ...

Page 8

... A-weighted; note see Fig. signal level kHz note 1 A-weighted at code 0000H A-weighted mA see Fig.1 = 100 Hz. ripple 8 Preliminary specification TDA1310A MIN. TYP. MAX 0.05 0. 2.2 1 0.05 0.08 0.2 ...

Page 9

... Philips Semiconductors Stereo Continuous Calibration DAC (CC-DAC) May 1994 Fig.4 Timing and input signals. Fig.5 Format of input signals. 9 Preliminary specification TDA1310A ...

Page 10

... Measured outside the specified operating supply voltage range ( and 5 V). Fig.6 Total harmonic distortion as a function of supply voltage (4f May 1994 Measured with a 1 kHz sinewave generated at a sample frequency ( Preliminary specification ) = 192 kHz. s Fig.7 Total harmonic distortion as a function of signal level ( TDA1310A ...

Page 11

... Philips Semiconductors Stereo Continuous Calibration DAC (CC-DAC) (1) Measured including all distortion plus noise at a signal level of 60 dB. (2) Measured including all distortion plus noise at a signal level of 0 dB. Fig.8 Total harmonic distortion as a function of frequency (4f May 1994 ). s 11 Preliminary specification TDA1310A ...

Page 12

... Philips Semiconductors Stereo Continuous Calibration DAC (CC-DAC) PACKAGE OUTLINES handbook, full pagewidth 3.60 3.05 1.15 max 8 1 Dimensions in mm. May 1994 9.8 9.2 3.2 max 4.2 max 0.51 min 2.54 0.254 M 0.53 (3x) max 1.73 max 5 6.48 6.20 4 Fig.9 Plastic DIL, 8-pin (DIL8). 12 Preliminary specification TDA1310A 8.25 7.80 0.38 max 7.62 10.0 8.3 MSA252 - 1 ...

Page 13

... Philips Semiconductors Stereo Continuous Calibration DAC (CC-DAC) andbook, full pagewidth S 0.7 0 pin 1 index 1.27 Dimensions in mm. May 1994 5.0 4.8 0 1.45 1.25 4 0.25 0.10 0.49 0.25 M 0.36 (8x) Fig.10 Plastic SO, 8-pin (SO8). 13 Preliminary specification TDA1310A 4.0 3.8 A 6.2 5.8 0.7 0.6 1.75 0.25 1.35 0.19 1 detail A MBC180 - 1 ...

Page 14

... C. (Pulse-heated soldering is not recommended for SO packages.) For pulse-heated solder tool (resistance) soldering of VSO packages, solder is applied to the substrate by dipping extra thick tin/lead plating before package placement. 14 Preliminary specification TDA1310A - BY HAND HELD SOLDERING ) ...

Page 15

... Philips customers using or selling these products for use in such applications their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. May 1994 15 Preliminary specification TDA1310A ...

Page 16

... Bangkok 10260, THAILAND, Tel. (662)398-0141, Fax. (662)398-3319. Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL, Tel. (0 212)279 2770, Fax. (0212)269 3094 United Kingdom: Philips Semiconductors Limited, P.O. Box 65, Philips House, Torrington Place, LONDON, WC1E 7HD, Tel. (071)436 41 44, Fax. (071)323 03 42 United States: INTEGRATED CIRCUITS: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel ...

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