TDA4662T Philips Semiconductors, TDA4662T Datasheet
TDA4662T
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TDA4662T Summary of contents
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DATA SHEET TDA4662 Baseband delay line Product specification Supersedes data of 1995 Oct 30 File under Integrated Circuits, IC02 INTEGRATED CIRCUITS 1996 Nov 14 ...
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... TYPE NUMBER NAME TDA4662 DIP16 plastic dual in-line package; 16 leads (300 mil) TDA4662T SO16 plastic small outline package; 16 leads; body width 3.9 mm 1996 Nov 14 GENERAL DESCRIPTION The TDA4662 is an integrated baseband delay line circuit with one line delay suitable for PAL and NTSC decoders with colour-difference signal outputs (R Y) and (B Y) ...
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... Philips Semiconductors Baseband delay line BLOCK DIAGRAM 1996 Nov 14 3 Product specification TDA4662 ...
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... Philips Semiconductors Baseband delay line PINNING SYMBOL PIN DESCRIPTION V 1 supply voltage for digital part (+ n.c. 2 not connected GND2 3 ground for digital part (0 V) i.c. 4 internally connected SAND 5 sandcastle pulse input n.c. 6 not connected i.c. 7 internally connected i.c. 8 internally connected V 9 supply voltage for analog part (+5 V) ...
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... Philips Semiconductors Baseband delay line CHARACTERISTICS input signals as specified in characteristics with 75% colour bars; super-sandcastle frequency of 15.625 kHz measurements taken in Fig.3; unless otherwise specified. amb SYMBOL PARAMETER V analog supply voltage (pin digital supply voltage (pin 1) P2 ...
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... Philips Semiconductors Baseband delay line SYMBOL PARAMETER Sandcastle pulse input (pin 5) f burst-key frequency/sandcastle frequency BK V top pulse voltage 5 V internal slicing level slice I input current 5 C input capacitance 5 Notes 1. Noise voltage kHz to 1 MHz The leading edge of the burst-key pulse or H-blanking pulse is used for timing. ...
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... Philips Semiconductors Baseband delay line PACKAGE OUTLINES DIP16: plastic dual in-line package; 16 leads (300 mil pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions UNIT max. min. max. 1.73 mm 4.2 0.51 3.2 1.30 0.068 inches 0.17 0.020 0.13 0.051 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. ...
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... Philips Semiconductors Baseband delay line SO16: plastic small outline package; 16 leads; body width 3 pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT max. 0.25 1.45 mm 1.75 0.25 0.10 1.25 0.0098 0.057 inches 0.069 0.01 0.0039 0.049 Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. ...
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... Philips Semiconductors Baseband delay line SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities ...
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... Philips Semiconductors Baseband delay line DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. ...
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... Philips Semiconductors Baseband delay line 1996 Nov 14 NOTES 11 Product specification TDA4662 ...
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... Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905, Tel. +9-5 800 234 7381 Middle East: see Italy For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. + 24825 © Philips Electronics N.V. 1996 All rights are reserved ...