TDA4867J Philips Semiconductors, TDA4867J Datasheet - Page 12

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TDA4867J

Manufacturer Part Number
TDA4867J
Description
Full bridge current driven vertical deflection booster
Manufacturer
Philips Semiconductors
Datasheets

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TDA4867J
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Philips Semiconductors
PACKAGE OUTLINE
2003 Feb 05
DBS9P: plastic DIL-bent-SIL power package; 9 leads (lead length 12/11 mm); exposed die pad
Full bridge current driven vertical
deflection booster
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
2. Plastic surface within circle area D 1 may protrude 0.04 mm maximum.
UNIT
mm
VERSION
OUTLINE
SOT523-1
A 2
2.7
2.3
(2)
0.80
0.65
b p
0.58
0.48
k
c
13.2
12.8
D
1
Z
(1)
D 1
6.2
5.8
IEC
(2)
D h
3.5
e
D 1
D
P
14.7
14.3
E
(1)
e 1
3.5
E h
JEDEC
2.54
b p
e
9
1.27
REFERENCES
e 1
0
q 2
5.08
w
e 2
M
E
3.0
2.0
k
non-concave
scale
EIAJ
12.4
11.0
12
L
5
11.4
10.0
L 1
x
6.7
5.5
L 2
10 mm
L
L 2
4.5
3.7
L 3
view B: mounting base side
B
L 3
Q
2.8
m
3.4
3.1
A 2
P
m
D h
1.15
0.85
Q
PROJECTION
EUROPEAN
17.5
16.3
e 2
q
E h
c
4.85
q 1
Preliminary specification
3.8
3.6
q 2
q
q 1
L 1
0.8
TDA4867J
v
v
M
ISSUE DATE
0.3
98-11-12
00-07-03
w
0.02
SOT523-1
x
1.65
1.10
Z
(1)

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