TDA8927 Philips Semiconductors, TDA8927 Datasheet
TDA8927
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TDA8927 Summary of contents
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... DATA SHEET TDA8927 Power stage 2 audio amplifier Objective specification File under Integrated Circuits, IC01 INTEGRATED CIRCUITS 80 W class-D 2001 Dec 11 ...
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... PACKAGE OUTLINES 17 SOLDERING 17.1 Introduction 17.2 Through-hole mount packages 17.2.1 Soldering by dipping or by solder wave 17.2.2 Manual soldering 17.3 Surface mount packages 17.3.1 Reflow soldering 17.3.2 Wave soldering 17.3.3 Manual soldering 17.4 Suitability of IC packages for wave, reflow and dipping soldering methods 18 DATA SHEET STATUS 19 DEFINITIONS 20 DISCLAIMERS 2 Objective specification TDA8927 ...
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... All mains fed audio systems Car audio (boosters). 3 GENERAL DESCRIPTION The TDA8927 is the switching power stage of a two-chip set for a high efficiency class-D audio power amplifier system. The system is split into two chips: TDA8927J/ST/TH; a digital power stage in a DBS17P, RDBS17P or HSOP24 power package TDA8929T ...
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... TEMPERATURE SENSOR 3 DIAG AND current CURRENT PROTECTION 15 14 DRIVER EN2 HIGH CONTROL 17 AND SW2 HANDSHAKE 16 DRIVER REL2 LOW Fig.1 Block diagram of TDA8927J and TDA8927ST. 4 Objective specification V DD2 V DD1 BOOT1 7 OUT1 V SS1 V DD2 12 BOOT2 11 OUT2 8 10 MGW138 V SS1 V SS2 TDA8927 ...
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... AND current CURRENT PROTECTION 14 13 DRIVER EN2 HIGH CONTROL 16 AND SW2 HANDSHAKE 15 DRIVER REL2 LOW 7 STAB 4 1, 12, 18 SS(sub) Fig.2 Block diagram of TDA8927TH. 5 Objective specification V DD2 V DD1 BOOT1 4 OUT1 V SS1 V DD2 10 BOOT2 9 OUT2 5 8 MGW140 V SS1 V SS2 TDA8927 ...
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... Objective specification TDA8927 DESCRIPTION ...
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... Dec 11 handbook, halfpage MGW142 7 Objective specification EN1 24 DIAG 23 REL1 22 SW1 21 n. SS(sub) 19 TDA8927TH n.c. 18 LIM 17 SW2 16 REL2 15 POWERUP 14 EN2 13 MGW144 Fig.4 Pin configuration of TDA8927TH. TDA8927 n. DD1 3 BOOT1 OUT1 SS1 6 STAB STAB SS2 OUT2 9 10 BOOT2 V DD2 11 12 n.c. ...
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... LIM and V SS output current can be set at a lower value, using: I O(max the power SS Example 1: with R 3.8 A. Example 2: with with SS In the TDA8927J and the TDA8927ST pin LIM is internally connected Objective specification Protections O VERTEMPERATURE ) exceeds 150 C, then HORT ...
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... SGND SGND2 11 mute IN2 8 INPUT PWM V i(2) STAGE MODULATOR IN2 SS2(sub) V DD2 V SSA V DDA Fig.5 Typical application schematic of the class-D system using TDA8929T and the TDA8927J. TDA8927J 20 PWM1 23 REL1 REL1 2 DRIVER HIGH CONTROL 24 SW1 SW1 1 AND 4 21 EN1 EN1 ...
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... HANDSHAKE 2 DRIVER LOW 9 temp TEMPERATURE SENSOR 3 AND current CURRENT PROTECTION 15 14 DRIVER HIGH CONTROL 17 AND HANDSHAKE 16 DRIVER LOW 8 V SS1 V SS2 Fig.6 Mono BTL application. 10 Objective specification 5 6 BOOT1 OUT1 7 V SS1 SGND V DD2 ( BOOT2 OUT2 11 10 MGU386 TDA8927 ...
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... TDA8927J TDA8927ST TDA8927TH R thermal resistance from junction to case th(j-c) TDA8927J TDA8927ST TDA8927TH 11 QUALITY SPECIFICATION In accordance with “SNW-FQ611-part D” if this type is used as an audio amplifier. 2001 Dec 11 CONDITIONS note 1 all pins with respect to V all pins with respect to V all pins with respect to each other ...
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... P 12 Objective specification MIN. TYP 1 300 100 170 150 20 TDA8927 MAX. UNIT STAB V V STAB STAB ...
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... kHz; note measured in reference design in Figs 9 and 11; unless otherwise amb measurement. ds(on measured in reference design in Figs 9 and 11; unless otherwise amb 13 Objective specification TDA8927 MIN. TYP. MAX ...
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... For the practical useable minimum and maximum duty factor ( ) which determines the maximum output power W(min) osc ------------------------------- 100% < < 1 – 2 Using the typical values: 3.5% < < 96.5%. 2001 Dec 11 CONDITIONS from pin SW to pin PWM note W(min) osc 100% ------------------------------ - 2 14 Objective specification TDA8927 MIN. TYP. MAX. UNIT 220 270 ns 0.2 0.3 ...
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... V DD PWM output ( STAB STAB V REL ( 100 ns Fig.7 Timing diagram PWM output, switch and release signals. 2001 Dec 11 1/f osc blank 15 Objective specification TDA8927 MGW145 ...
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... Acrobat reader. white to force landscape pages to be ... 100 SW1 V REL1 V STAB V DIAG DD2 13 TDA8927J EN1 4 DRIVER HIGH CONTROL SW1 1 AND HANDSHAKE REL1 2 DRIVER LOW STAB 9 temp ...
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... In principle the loudspeaker can be connected between the outputs of the two single-ended demodulation filters. 15.2 Remarks The case of the package of the TDA8927J/ST and the heatsink of the TDA8927TH are internally connected to V 15.3 Output power The output power in single-ended applications can be estimated using the formulae: ...
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... BTL: remove R6, R7, C23, C26 and C27 and close J5 and J6. C22 and C23 influence the low-pass frequency response and should be tuned with the real load (loudspeaker). Inputs floating or inputs referenced to QGND (close J1 and J4) or referenced to V Fig.9 Two-chip class-D audio amplifier application diagram for TDA8926J or TDA8927J and TDA8929T. V DDD V SSA ...
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... C29 C21 C19 GND C20 C18 C30 C31 QGND Silk screen bottom, top view Fig.10 Printed-circuit board layout for TDA8926J or TDA8927J and TDA8929T. D1 C24 C40 C25 C26 C41 C27 03-2001 ON S1 MUTE OFF C44 C38 C36 C22 ...
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... R9 and R10 are only necessary in BTL applications with asymmetrical supply. BTL: remove R6, R7, C4, C7 and C8 and close J5 and J6. Demodulation coils L2 and L4 should be matched in BTL. Inputs floating or inputs referenced to QGND (close J1 and J4) or referenced to V Fig.11 Two-chip class-D audio amplifier application diagram for TDA8926TH or TDA8927TH and TDA8929T. V DDD V SSD C24 ...
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... C10 C9 R17 C39 C38 R16 R9 R10 C43 C42 C41 C40 C16 C17 J3 J4 QGND Silk screen bottom, top view Fig.12 Printed-circuit board layout for TDA8926TH or TDA8927TH and TDA8929T. C22 D1 C23 OFF In1 C11 C20 C18 C4 C12 C19 C21 ...
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... Philips Semiconductors Power stage class-D audio amplifier 15.5 Reference design bill of materials Table 1 Two-chip class-D audio amplifier PCB (Version 2.1; 03-2001) for TDA8926J or TDA8927J and TDA8929T (see Figs 9 and 10) COMPONENT DESCRIPTION In1 and In2 Cinch input connectors Out1, Out2 supply/output connectors ...
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... P (2) P Fig.14 THD + function of input frequency. 23 Objective specification COMMENTS 4 SMD1206 SMD1206 4 SMD1206 2 SMD1206 SMD1206 SMD1206 SMD1206 SMD1206 SMD1206 ( ( SE TDA8927 MLD628 (Hz) ...
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... Objective specification ( ( BTL TDA8927 MLD630 (Hz) MLD632 (Hz) ...
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... Fig.22 Output power as a function of supply 25 Objective specification 100 (3) (1) ( kHz SE. 8 BTL. 8 SE. 200 (2) 160 120 (1) ( kHz BTL. 8 BTL. 4 SE. 8 SE. voltage. TDA8927 MLD610 120 150 P o (W) MLD612 (V) ...
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... (1) 1 (2) 2 (3) 2 Fig.26 Gain as a function of input frequency. 26 Objective specification TDA8927 ( frequency. (1) (2) ( 100 mV; ...
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... Fig.28 SVRR as a function of V MLD619 380 handbook, halfpage f clk (kHz) 372 364 356 348 340 open. L Fig.30 Clock frequency as a function of supply 27 Objective specification TDA8927 (1) (2) ( ripple (V) with respect to GND: ripple = 1 kHz. = 100 Hz Hz. ripple voltage ...
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... V; 1500 F per supply line into into 1 8 SE. o Fig.32 SVRR as a function of input frequency ( 100 200 300 400 = kHz; THD + frequency. TDA8927 MLD622 (Hz) MLD624 500 600 f clk (kHz) ...
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... Fig.35 Quiescent current as a function of clock frequency. 2001 Dec 11 MLD625 1000 handbook, halfpage V r(PWM) (mV) 800 600 400 200 0 500 600 100 f clk (kHz Fig.36 PWM residual voltage as a function of clock 29 Objective specification TDA8927 200 300 400 500 f clk (kHz frequency. MLD626 600 ...
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... 20.0 12.2 10 2.54 1.27 5.08 19.6 11.8 REFERENCES JEDEC EIAJ 30 Objective specification non-concave view B: mounting base side 3.4 12.4 2.4 2.1 6 4.3 3.1 11.0 1.6 1.8 EUROPEAN PROJECTION TDA8927 SOT243 ( 2.00 0.8 0.4 0.03 1.45 ISSUE DATE 97-12-16 99-12-17 ...
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... 24.0 20.0 12.2 10 2.54 1.27 23.6 19.6 11.8 REFERENCES JEDEC EIAJ 31 non-concave view B: mounting base side 3.4 4.7 4.7 2.1 2.54 6 3.1 4.1 4.1 1.8 EUROPEAN PROJECTION Objective specification TDA8927 SOT577-1 ( 2.00 0.6 0.4 0.03 1.45 ISSUE DATE 00-01-19 00-03-15 ...
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... scale (2) ( 0.32 16.0 13.0 1.1 11.1 6.2 2.9 0.23 15.8 12.6 0.9 10.9 5.8 2.5 REFERENCES JEDEC EIAJ 32 Objective specification detail 14.5 1.1 1.7 1.0 0.25 0.25 0.03 13.9 0.8 1.5 EUROPEAN PROJECTION TDA8927 SOT566 2.7 0.07 0 2.2 ISSUE DATE 00-03-24 ...
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... Use a low voltage ( less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds 300 C. When using a dedicated tool, all other leads can be soldered in one operation within seconds between 270 and 320 C. 33 Objective specification TDA8927 ...
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... Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. 2001 Dec 11 PACKAGE suitable not suitable not suitable suitable not recommended not recommended 34 Objective specification TDA8927 SOLDERING METHOD (1) WAVE REFLOW DIPPING (2) suitable suitable (3) suitable suitable ...
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... Objective specification TDA8927 DEFINITIONS These products are not Philips Semiconductors ...
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... Philips Semiconductors – a worldwide company Contact information For additional information please visit http://www.semiconductors.philips.com. For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com. © Koninklijke Philips Electronics N.V. 2001 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. ...