MCP73213-A6AI/MF Microchip Technology, MCP73213-A6AI/MF Datasheet - Page 13

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MCP73213-A6AI/MF

Manufacturer Part Number
MCP73213-A6AI/MF
Description
Li-Ion Battery Charge Management Controller; Package: 10L DFN 3x3mm; Temperature Range: 150C / 1hr w/l 24 hours
Manufacturer
Microchip Technology
Datasheet
3.0
The descriptions of the pins are listed in
TABLE 3-1:
3.1
A supply voltage of [V
recommended. Bypass to V
The V
suddenly rise of input voltage from spikes or low cost
ac-dc wall adapter.
3.2
Connect to the positive terminal of the battery. Bypass
to V
when the battery is disconnected.
3.3
No connect.
3.4
STAT is an open-drain logic output for connection to an
LED for charge status indication in standalone
applications. Alternatively, a pull-up resistor can be
applied for interfacing to a host microcontroller. Refer to
Table 5-1
charge cycle.
© 2009 Microchip Technology Inc.
MCP73213
SS
DFN-10
DD
1, 2
3, 4
5, 6
8, 9
with a minimum of 1 µF to ensure loop stability
10
11
7
PIN DESCRIPTION
Battery Management Input Supply
(V
pin is rated 18V absolute maximum to prevent
Battery Charge Control Output
(V
No Connect (NC)
Status Output (STAT)
for a summary of the status output during a
DD
BAT
)
)
PIN FUNCTION TABLES
Symbol
PROG
REG
STAT
V
V
V
NC
EP
BAT
DD
SS
(Typical) + 0.3V] to 13.0V is
SS
with a minimum of 1 µF.
I/O
I/O
I/O
O
I
Table
Battery Management Input Supply
Battery Charge Control Output
No Connection
Battery Charge Status Output
Battery Management 0V Reference
Battery Charge Current Regulation Program and Charge Control Enable
Exposed Pad
3-1.
3.5
Connect to the negative terminal of the battery and
input supply.
3.6
The fast charge current is set by placing a resistor from
PROG to V
PROG pin also serves as charge control enable. When
a typical 200 kΩ impedance is applied to PROG pin,
the MCP73213 is disabled until the high-impedance is
removed. Refer to Section 5.5 “Constant Current
Mode - Fast Charge” for details.
3.7
The Exposed Thermal Pad (EP) shall be connected to
the exposed copper area on the Printed Circuit Board
(PCB) for the thermal enhancement. Additional vias on
the copper area under the MCP73213 device can
improve the performance of heat dissipation and
simplify the assembly process.
Description
Battery Management 0V Reference
(V
Current Regulation Set (PROG)
Exposed Pad (EP)
SS
SS
)
during constant current (CC) mode.
MCP73213
DS22190B-page 13

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