NCP4894 ON Semiconductor, NCP4894 Datasheet
NCP4894
Available stocks
Related parts for NCP4894
NCP4894 Summary of contents
Page 1
... NCP4894 are a guarantee of a high quality sound, for example, in mobile phones applications. With a 10% THD+N value the NCP4894 is capable of delivering 1 continuous average power to an 8.0 W load from a 5.5 V power supply. With the same load conditions and a 5.0 V battery voltage, it ensures 1 ...
Page 2
... SD SELECT Status 0 0 Shutdown Shutdown Ci2 Ri2 Positive Diff Input from DAC 390 Figure 1. Typical NCP4894 Application Circuit with Differential Input NCP4894 Rf1 INM − + BYPASS VP BYPASS VMC BRIDGE SELECT SHUTDOWN CONTROL ...
Page 3
... The SD SELECT pin must be toggled to the same state as the SD MODE pin to force the device in shutdown mode. NCP4894 PIN CONNECTIONS Micro−10 SD SELECT 1 10 OUTA INM MODE INP BYPASS ...
Page 4
... Human Body Model, 100 pF discharge through a 1.5 kW resistor following specification JESD22/A114. 6. Machine Model, 200 pF discharged through all pins following specification JESD22/A115. 7. Maximum ratings per JEDEC standard JESD78. NCP4894 Symbol ...
Page 5
... Min/Max limits are guaranteed by design, test or statistical analysis. 9. This parameter is not tested in production for 9−Pin Flip−Chip CSP package in case of a 5.0 V power supply, however it is correlated based on a 3.0 V power supply testing. 10. See page 11 for a theoretical approach of these parameters. NCP4894 between −40°C to +85°C (Unless otherwise noted). A Symbol ...
Page 6
... Figure 4. THDN versus Frequency kHz 0.1 0.01 0.001 0 200 400 600 800 OUTPUT POWER (mW) Figure 6. THDN versus Output Power NCP4894 0.100 0.010 0.001 10000 100000 10 100 Figure 3. THDN versus Frequency 0.100 0.010 0.001 10000 100000 10 100 Figure 5. THDN versus Frequency ...
Page 7
... V = 200 mV pk=pk ripple Inputs grounded with 10 W − − −50 −60 −70 −80 −90 −100 100 1000 FREQUENCY (Hz) Figure 12. PSRR @ NCP4894 10 1 0.1 0.01 0.001 0 300 Figure 9. THDN versus Output Power − −20 V ripple Inputs grounded with 10 W − ...
Page 8
... −40 −50 −60 −60 100 1000 100000 FREQUENCY (Hz) Figure 16. CMRR @ 100 NCP4894 OFF 1 100000 10 100 FREQUENCY (Hz) Figure 18. Noise Floor @ VP = 3.6 V http://onsemi.com 10000 100000 10000 100000 NCP4894 ON 1000 10000 100000 ...
Page 9
... Ch1 = OUTA Ch2 = OUTB Ch3 = Shutdown & Math1 = OUTA−OUTB Figure 22. Turning−off Sequence @ and kHz http://onsemi.com NCP4894 Ch1 = OUTA Ch2 = OUTB Ch3 = Shutdown & Math1 = OUTA−OUTB Figure 21. Turning−on Sequence Zoom @ and kHz Ch1 = OUTA Ch2 = OUTB Ch3 = Shutdown & ...
Page 10
... P = 633 mW Dmax 100 for 100 T , AMBIENT TEMPERATURE (°C) A Figure 28. Power Derating − 9−Pin Flip−Chip CSP NCP4894 0.3 0.25 0.2 0.15 0.1 0.05 0 0.8 1 1.2 0 Figure 25. Power Dissipation versus Output 0.4 0.35 0.3 0.25 0.2 0.15 0.1 0.05 0 0.3 0.4 0 0.05 Figure 27. Power Dissipation versus Output ...
Page 11
... Detailed Description The NCP4894 audio amplifier can operate under 2.6 V until 5.5 V power supply. It delivers 320 mW rms output power to 4.0 W load (VP = 2.6 V) and 1.0 W rms output power to 8.0 W load (VP = 5.0 V). The structure of the NCP4894 is basically composed of two identical internal power amplifiers. Both are externally configurable with gain− ...
Page 12
... In order to optimize device and system performance, the NCP4894 should be used in low gain configurations. The low gain configuration minimizes THD + noise values and maximizes the signal to noise ratio, and the amplifier can still be used without running into the bandwidth limitations ...
Page 13
... NCP4894 Silkscreen Layer Top Layer Figure 31. Demonstration Board for 9−Pin Flip−Chip CSP Device − PCB Layers http://onsemi.com Bottom Layer 13 ...
Page 14
... Specifications Brochure, BRD8011/D. NOTE: This product is offered with either autectic (SnPb−tin/lead) or lead−free solder bumps (G suffix) depending on the PCB assembly process. The NCP4894FCT1G, NCP4894DMR2G, NCP4894MNR2G version requires a lead−free solder paste and should not be used with a SnPb solder paste. NCP4894 ...
Page 15
... SOLDERING FOOTPRINT* 0.265 0.01 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com NCP4894 FC SUFFIX CASE 499AL−01 ISSUE O NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS. ...
Page 16
... Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. NCP4894 Micro−10 DM SUFFIX CASE 846B−03 ISSUE D NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. ...
Page 17
... DETAIL B 0.10 C 0.08 C 10X SIDE VIEW 10X 10X 10X 0. BOTTOM VIEW 0.05 C NOTE 3 NCP4894 PACKAGE DIMENSIONS DFN10 MN SUFFIX CASE 485C−01 ISSUE EDGE OF PACKAGE L1 E DETAIL A Bottom View (Optional) A SEATING PLANE A1 C EXPOSED Cu MOLD CMPD DETAIL A É É É É ...
Page 18
... USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Phone: 81−3−5773−3850 http://onsemi.com 18 ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative. NCP4894/D ...