USBB13AP77016-XXX-B06 NEC Electronics, USBB13AP77016-XXX-B06 Datasheet - Page 29

• Manufacturer Part Number: USBB13AP77016-XXX-B06
• Description: DSP middleware(AMR voice CODEC)
• Manufacturer: NEC Electronics

2.3 Memory Structure
PUBLIC quasi directive to define a symbol name. For the size of each memory, refer to Table 2-6.
This section explains the structure of the memory required for the µ SAP77016-B06 library.
In the µ SAP77016-B06, scratch memory and static memory areas must be defined separately. Be sure to use the
(1) Scratch memory area
(2) Static memory area
This area does not have to be saved. The user can use this area freely after encoding/decoding one frame.
This area always includes saved data. If the user manipulates this area after initialization processing, normal
operation of the µ SAP77016-B06 library is not guaranteed.
Remark
Example:
Example:
lib_Scratch_x
lib_Scratch_y
amr_Static_enc_x
amr_Static_enc_y
amr_Static_dec_x
amr_Static_dec_y
Symbol Name
The memory area can be allocated by a macro defined by amr_lib.h (Refer to 2.4 Macro).
public
public
SCRATCH_X
lib_Scratch_x:
SCRATCH_Y
lib_Scratch_y:
public
public
public
public
AMR_STATIC_X
amr_Static_enc_x:
amr_Static_dec_x:
AMR_STATIC_Y
amr_Static_enc_y:
amr_Static_dec_y:
Table 2-6. Symbol Name and Size of Memory
lib_Scratch_x
lib_Scratch_y
amr_Static_enc_x
amr_Static_enc_y
amr_Static_dec_x
amr_Static_dec_y
Size [Words]
CHAPTER 2 LIBRARY SPECIFICATIONS
2025
909
509
955
402
525
User’s Manual U15165EJ3V0UM
XRAMSEG
DS
YRAMSEG
DS
XRAMSEG
DS
DS
YRAMSEG
DS
DS
X/Y Plane
AMR_MAX_SCRATCH_X_SIZE
AMR_MAX_SCRATCH_Y_SIZE
AMR_MAX_STATIC_ENC_X_SIZE
AMR_MAX_STATIC_DEC_X_SIZE
AMR_MAX_STATIC_ENC_Y_SIZE
AMR_MAX_STATIC_DEC_Y_SIZE
X
Y
X
Y
X
Y
Encoder/decoder common scratch area
Encoder/decoder common scratch area
Static area for encoder
Static area for encoder
Static area for decoder
Static area for decoder
Description
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