SGM2013 Sony Corporation, SGM2013 Datasheet

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SGM2013

Manufacturer Part Number
SGM2013
Description
GaAs N-channel Dual-Gate MES FET
Manufacturer
Sony Corporation
Datasheet

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Part Number:
SGM2013-1.8XK3/TR
Manufacturer:
SGMC
Quantity:
20 000
Part Number:
SGM2013-1.8XK3L/TR
Manufacturer:
SGMC
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SGM2013-1.8XN3/TR
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SGMICRO
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Part Number:
SGM2013-2.5XK3/TR
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SGM
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20 000
Part Number:
SGM2013-2.5XK3L/TR
Manufacturer:
SGMC
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20 000
For the availability of this product, please contact the sales office.
Description
MES FET for UHF-band low-noise amplification. This
FET is suitable for a wide range of applications
including cellular/cordless phone.
Features
• Ultra-small package
• Low voltage operation
• Low noise NF = 1.4dB (Typ) at 900MHz, NF = 1.7dB (Typ) at 1.5GHz
• High gain Ga = 18dB (Typ) at 900MHz, Ga = 16dB (Typ) at 1.5GHz
• High stability
• Built-in gate protection diode
Application
Structure
Absolute Maximum Ratings (Ta = 25°C)
• Drain to source voltage
• Gate 1 to source voltage
• Gate 2 to source voltage
• Drain current
• Allowable power dissipation
• Channel temperature
• Storage temperature
The SGM2013N is an N-channel dual-gate GaAs
UHF-band high-frequency amplifier and mixer
GaAs, N-channel, dual-gate metal semiconductor field-effect transistor
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by
any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the
operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
GaAs N-channel Dual-Gate MES FET
V
V
V
I
P
Tch
Tstg
D
DSX
G1S
G2S
D
–55 to +150
100
125
–4
–4
18
6
– 1 –
mW
mA
°C
°C
V
V
V
SGM2013N
M-281
E97144-PS

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SGM2013 Summary of contents

Page 1

... GaAs N-channel Dual-Gate MES FET For the availability of this product, please contact the sales office. Description The SGM2013N is an N-channel dual-gate GaAs MES FET for UHF-band low-noise amplification. This FET is suitable for a wide range of applications including cellular/cordless phone. Features • Ultra-small package • ...

Page 2

... Min. Typ 0. G1S ( –2.0 –1.5 –1.0 –0.5 V – Gate 1 to source voltage [V] G1S SGM2013N (Ta = 25°C) Max. Unit –4 µA –4 µ –1.5 V –1 2 G2S = 0.5V 0.25V 0V –0.25V – ...

Page 3

... SGM2013N gm vs. V G1S = 2V) –1.5 –1.0 –0.5 V – Gate 1 source voltage [V] G1S NF – Drain to source voltage [V] DS NF 0.5V 2mA) DS G2S D Ga NFmin 0 ...

Page 4

... V = 0.5V 2mA) DS G2S D Rn (Ω) MAG 4.2 85.0 6.1 83.9 8.0 82.9 9.8 81.9 11.5 80.9 13.2 79.9 14.8 79.0 16.4 78.1 18.0 77.2 19.6 76.3 21.1 75.5 22.6 74.7 24.2 74.0 25.8 73.3 27.4 72.6 29.1 71.9 30.8 71.3 32.5 70.7 34.4 70.1 – 4 – = 2mA) D S12 S22 MAG ANG MAG 0.98 0.00 87.0 0.98 0.00 85.4 0.00 84.7 0.98 0.00 0.98 83.0 0.98 0.00 81.9 0.98 0.01 80.3 0.01 0.98 78.9 0.98 0.01 77.8 0.97 0.01 76.9 0.01 75.8 0.97 0.01 0.96 75.0 0.96 0.01 73.8 0.96 0.01 72.9 0.01 0.96 72.8 0.96 0.01 72.5 0.96 0.01 71.5 0.01 70.9 0.95 0.01 0.95 69.7 0.95 0.01 68.6 SGM2013N ANG –2.0 –3.1 –4.0 –5.2 –6.1 –7.2 –8.3 –9.7 –10.5 –11.7 –12.7 –13.8 –14.8 –15.9 –16.9 –18.0 –19.0 –20.0 –20.6 ...

Page 5

... Package Outline Unit 0.1 0.3 – 0.05 SONY CODE EIAJ CODE JEDEC CODE M-281 2.0 ± 0.2 1.3 (0.65) (0.65 0.1 0.4 – 0.05 (0.65) (0.6) 1.25 PACKAGE MATERIAL LEAD TREATMENT M-281 LEAD MATERIAL PACKAGE WEIGHT – 5 – SGM2013N 0.9 ± 0.1 0 ± 0.1 + 0.1 0.1 – 0. Source 2 : Gate Gate Drain EPOXY RESIN SOLDER PLATING COPPER 0.1g ...

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