TFA9843J Philips Semiconductors, TFA9843J Datasheet - Page 18

• Manufacturer Part Number: TFA9843J
• Description: 2-channel audio amplifier
• Manufacturer: Philips Semiconductors

Philips Semiconductors
16. Soldering
9397 750 12587
Preliminary data
16.1 Introduction to soldering through-hole mount packages
16.2 Soldering by dipping or by solder wave
16.3 Manual soldering
16.4 Package related soldering information
This text gives a brief insight to wave, dip and manual soldering. A more in-depth
account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit
Packages (document order number 9398 652 90011).
Wave soldering is the preferred method for mounting of through-hole mount IC
packages on a printed-circuit board.
Driven by legislation and environmental forces the worldwide use of lead-free solder
pastes is increasing. Typical dwell time of the leads in the wave ranges from
3 to 4 seconds at 250 C or 265 C, depending on solder material applied, SnPb or
Pb-free respectively.
The total contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the
plastic body must not exceed the specified maximum storage temperature (T
If the printed-circuit board has been pre-heated, forced cooling may be necessary
immediately after soldering to keep the temperature within the permissible limit.
Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the
seating plane or not more than 2 mm above it. If the temperature of the soldering iron
bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit
temperature is between 300 and 400 C, contact may be up to 5 seconds.
Table 11:
[1]
[2]
Package
DBS, DIP, HDIP, RDBS, SDIP, SIL
PMFP
For SDIP packages, the longitudinal axis must be parallel to the transport direction of the
printed-circuit board.
For PMFP packages hot bar soldering or manual soldering is suitable.
[2]
Suitability of through-hole mount IC packages for dipping and wave
soldering methods
Rev. 02 — 19 January 2004
2-channel audio amplifier (2 x SE or 1 x BTL)
Soldering method
Dipping
suitable
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Wave
suitable
not suitable
TFA9843J
[1]
stg(max)
18 of 21
).