25AA256 Microchip Technology, 25AA256 Datasheet - Page 15

• Manufacturer Part Number: 25AA256
• Description: 256K SPI Bus Serial EEPROM
• Manufacturer: Microchip Technology

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© 2007 Microchip Technology Inc.
8-Lead Plastic Dual Flat, No Lead Package (MF) – 6x5 mm Body [DFN-S]
PUNCH SINGULATED
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package may have one or more exposed tie bars at ends.
3. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Base Thickness
Overall Length
Molded Package Length
Exposed Pad Length
Overall Width
Molded Package Width
Exposed Pad Width
Contact Width
Contact Length
Contact-to-Exposed Pad
Model Draft Angle Top
NOTE 1
A
A1
N
φ
1
TOP VIEW
2
D1
D
A2
Dimension Limits
E1
E
EXPOSED
A3
Units
D1
D2
A2
A1
A3
E1
E2
PAD
N
A
D
E
K
e
b
L
φ
NOTE 2
b
0.00
0.50
MIN
3.85
2.16
0.35
0.20
–
–
–
BOTTOM VIEW
25AA256/25LC256
D2
MILLIMETERS
2
1.27 BSC
0.20 REF
4.92 BSC
4.67 BSC
5.99 BSC
5.74 BSC
e
NOM
0.85
0.65
0.01
4.00
2.31
0.40
0.60
1
8
–
–
Microchip Technology Drawing C04-113B
N
E2
NOTE 1
K
MAX
1.00
0.05
0.47
0.75
0.80
4.15
2.46
12°
–
L
DS21822F-page 15