ntd4813n ON Semiconductor, ntd4813n Datasheet
ntd4813n
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ntd4813n Summary of contents
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... CASE 369AC CASE 369D 3 IPAK IPAK (Straight Lead) (Straight Lead DPAK) MARKING DIAGRAMS & PIN ASSIGNMENTS 4 Drain 4 Drain Gate Drain Source Source Gate Drain Source Y = Year WW = Work Week 4813N = Device Code G = Pb-Free Package ORDERING INFORMATION Publication Order Number: NTD4813N/D ...
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... Total Gate Charge SWITCHING CHARACTERISTICS (Note 4) Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time 3. Pulse Test: pulse width v 300 ms, duty cycle v 2%. 4. Switching characteristics are independent of operating junction temperatures. NTD4813N (T = 25°C unless otherwise specified) J Symbol Test Condition = 250 mA V ...
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... Reverse Recovery Charge PACKAGE PARASITIC VALUES Source Inductance Drain Inductance, DPAK Drain Inductance, IPAK Gate Inductance Gate Resistance 3. Pulse Test: pulse width v 300 ms, duty cycle v 2%. 4. Switching characteristics are independent of operating junction temperatures. NTD4813N = 25°C unless otherwise specified) J Symbol Test Condition t d(ON ...
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... Figure 3. On-Resistance vs. Gate-to-Source Voltage 1 1 1.6 1.5 1.4 1.3 1.2 1.1 1.0 0.9 0.8 0.7 0.6 -50 - JUNCTION TEMPERATURE (°C) J Figure 5. On-Resistance Variation with Temperature NTD4813N 60 ≥ 25° 0.042 T = 25° ...
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... SINGLE PULSE T = 25°C C 100 10 R LIMIT DS(on) THERMAL LIMIT PACKAGE LIMIT 1 0 DRAIN-TO-SOURCE VOLTAGE (VOLTS) DS Figure 11. Maximum Rated Forward Biased Safe Operating Area NTD4813N TYPICAL PERFORMANCE CURVES 25°C J 13.5 12 10 4 Figure 8. Gate-To-Source and Drain-To-Source ...
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... Device NTD4813NT4G NTD4813N-1G NTD4813N-35G IPAK Trimmed Lead †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. NTD4813N TYPICAL PERFORMANCE CURVES 25°C 100°C 125°C 10 100 PULSE WIDTH (ms) Figure 13 ...
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... 0.13 (0.005) M 5.80 0.228 *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. NTD4813N PACKAGE DIMENSIONS DPAK (SINGLE GAUGE) CASE 369C ISSUE O SEATING -T- PLANE SOLDERING FOOTPRINT* 6.20 3 ...
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... BSC 2.29 BSC G H 0.034 0.040 0.87 1.01 J 0.018 0.023 0.46 0.58 K 0.350 0.380 8.89 9.65 R 0.180 0.215 4.45 5.45 S 0.025 0.040 0.63 1.01 V 0.035 0.050 0.89 1.27 Z 0.155 --- 3.93 --- STYLE 2: PIN 1. GATE 2. DRAIN 3. SOURCE 4. DRAIN ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative NTD4813N/D ...