idc04s60c Infineon Technologies Corporation, idc04s60c Datasheet
idc04s60c
Related parts for idc04s60c
idc04s60c Summary of contents
Page 1
... SMPS, PFC, snubber I Die Size F 4A 1.146 x 0.968 mm suitable for epoxy and soft solder die bonding Electrically conductive glue or solder store in original container, in dry nitrogen, < 6 month at an ambient temperature of 23°C IDC04S60C Package 2 sawn on foil 1.146x 0.968 0.909 x 0.731 1.11 / 0.74 355 75 0 ...
Page 2
... I <= di/dt=200A =400V ° f=1MHz 600V and di/dt. No reverse recovery time constant t j LOAD IDC04S60C Value Unit 600 V 600 132 -55...+175 C Value Unit min. Typ. max. 0.5 50 µA 1.7 1.9 V Value Unit min ...
Page 3
... CHIP DRAWING: Edited by INFINEON Technologies, AIM PMD D CID CLS, Edition 1, 05.04.2006 IDC04S60C ...
Page 4
... Life support devices or systems are intended to be implanted in the human body support and / or maintain and sustain and / or protect human life. If they fail reasonable to assume that the health of the user or other persons may be endangered. Edited by INFINEON Technologies, AIM PMD D CID CLS, Edition 1, 05.04.2006 IDC04S60C INFINEON TECHNOLOGIES IDT04S60C ...