idc05s60c Infineon Technologies Corporation, idc05s60c Datasheet
idc05s60c
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idc05s60c Summary of contents
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... Die Size 1.45 x 1.162 mm suitable for epoxy and soft solder die bonding Electrically conductive glue or solder store in original container, in dry nitrogen, < 6 month at an ambient temperature of 23°C IDC05S60C Package sawn on foil 1.45x 1.162 1.213 x 0.925 1.68 / 1.22 355 75 0 2182 pcs ...
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... I <= di/dt=200A =400V ° f=1MHz 600V and di/dt. No reverse recovery time constant t j LOAD IDC05S60C Value Unit 600 V 600 180 -55...+175 C Value Unit min. Typ. max. 0.6 70 µA 1.5 1.7 V Value Unit min ...
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... CHIP DRAWING: Edited by INFINEON Technologies, AIM PMD D CID CLS, Edition 1, 05.04.2006 IDC05S60C ...
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... Life support devices or systems are intended to be implanted in the human body support and / or maintain and sustain and / or protect human life. If they fail reasonable to assume that the health of the user or other persons may be endangered. Edited by INFINEON Technologies, AIM PMD D CID CLS, Edition 1, 05.04.2006 IDC05S60C INFINEON TECHNOLOGIES IDT05S60C ...