idc08s120 Infineon Technologies Corporation, idc08s120 Datasheet
idc08s120
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idc08s120 Summary of contents
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... Based on I Die Size F 7.5A 2.012 x 2.012 mm suitable for epoxy and soft solder die bonding Electrically conductive glue or solder Store in original container, in dry nitrogen, < 6 month at an ambient temperature of 23°C IDC08S120 Package 2 sawn on foil 2.012 x 2.012 1.476 x 1.476 4. 362 75 0 901 pcs ...
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... Conditions Conditions IDC08S120 Value Unit 1200 V 1200 7 160 -55...+175 C Value Unit min. Typ. max. ...
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... 00V ° f=1MHz 600V di/dt. No reverse recovery time constant t j LOAD IDC08S120 Value Unit min. Typ. max <10 ns 380 and j LOAD due and di/dt). ...
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... CHIP DRAWING Edited by INFINEON Technologies, AIM PMD D CID CLS, Rev. 2.0, 28.02.2007 IDC08S120 ...
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... Life support devices or systems are intended to be implanted in the human body support and / or maintain and sustain and / or protect human life. If they fail reasonable to assume that the health of the user or other persons may be endangered. Edited by INFINEON Technologies, AIM PMD D CID CLS, Rev. 2.0, 28.02.2007 IDC08S120 INFINEON TECHNOLOGIES IDH08S120 ...