ma4gp030-277 M/A-COM Technology Solutions, Inc., ma4gp030-277 Datasheet - Page 6

• Manufacturer Part Number: ma4gp030-277
• Description: Gaas Diode Chips
• Manufacturer: M/A-COM Technology Solutions, Inc.

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ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
RoHS Compliant
GaAs PIN Diode Chips
Die Handling and Mounting Information
Handling: All semiconductor chips should be handled with care to avoid damage or contamination
from perspiration, salts, and skin oils. The use of plastic tipped tweezers or vacuum pickups is
strongly recommended for individual components. Bulk handling should ensure that abrasion and
mechanical shock are minimized.
Die Attach Surface: Die can be mounted with an 80Au/Sn20, eutectic solder preform or electrically
conductive silver epoxy. The metal RF and D.C. ground plane mounting surface must be free of con-
tamination and should have a surface flatness of < ±0.002”.
Eutectic Die Attachment Using Hot Gas Die Bonder: A work surface temperature of 255
recommended. When hot forming gas is applied, the work area temperature should be approximately
290
seconds.
Eutectic Die Attachment Using Reflow Oven: See
Procedures for Chip Diode Devices” at
Electrically Conductive Epoxy Die Attachment: A controlled amount of electrically conductive,
silver epoxy, approximately 1–2 mils in thickness, should be used to minimize ohmic and thermal
resistance. A thin epoxy fillet should be visible around the perimeter of the chip after placement to
ensure full area coverage. Cure conductive epoxy per manufacturer’s schedule. Typically 150°C for
1 hour.
Wire and Ribbon Bonding: It is recommended that thermo-compression or thermo-sonic bonding
be used with little or no ultrasonics. The bonding tool and wire or ribbon used should be smaller than
the anode contact diameter. A bonder heat stage temperature setting of 200
of 150°C and a force of 18 to 50 grams is suggested. If ultrasonic scrubbing is necessary it should be
adjusted to the minimum required to achieve a good bond. Excessive energy may cause the anode
metallization to separate from the chip.
For more detailed handling and assembly instructions, see
“Bonding and Handling Procedures for Chip Diode Devices” at www.macom.com.
o
C. The chip should not be exposed to temperatures greater than 320
www.macom.com
Application Note
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
• North America Tel: [phone] / Fax: [phone]
• Europe Tel: [phone] / Fax: [phone]
• Asia/Pacific Tel: [phone] / Fax: [phone]
Visit www.macomtech.com for additional data sheets and product information.
for recommended time-temperature profile.
Application Note
M541, “Bonding and Handling
o
C, tool tip temperature
o
C for more than 10
M541,
o
Rev. V1
C is