t10xb ETC-unknow, t10xb Datasheet
t10xb
Manufacturer Part Number
t10xb
Description
10-ampere Silicon Bridge Rectifier
Manufacturer
ETC-unknow
Datasheet
1.T10XB.pdf
(2 pages)
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Part Number:
t10xb60
Manufacturer:
大昌
Quantity:
20 000
Maximum Ratings & Characteristics
Single Phase, 60 Hz, Resistive or Inductive Load
T
Reference Table for Heat-Sink Size
Note: Vertical Mounting at T
Manufactured by Tianjin Zhong – Huan Semiconductor Co., Ltd.
FEATURES
a
CHARACTERISTIC
Peak Repetitive Reverse Voltage
RMS Reverse Voltage
Average Rectified Output Current @ T
Average Rectified Output Current @ T
Non-Repetitive Peak Forward Surge Current
10 mS single half sine-wave superimposed on rated load
Maximum Forward Voltage per Element, I
Peak Reverse Current per element at V
Operating and Storage Temperature Range
Average Rectified Output Current in Amps
Cooling Fin Single-face Area S1 (cm
Cooling Fin Single-face Area S2 (cm
= 25ºC Unless Otherwise Specified
Low Reverse Leakage Current
Surge Overload Rating to 120A Peak
Ideal for Printed Circuit Board Applications
Epoxy Material – UL Recognition
Flammability Classification 94V-0
a
= 40ºC. HS Material: S1 = 1.5mm-Thick Aluminum, S2 = 3.0mm-Thick Copper
C
a
R
= 25ºC w/o cooling fin
= 108ºC w/ cooling fin
2
2
= V
F
)
)
= 5.0 A
RRM
3.0
4
8
10-AMPERE SILICON BRIDGE RECTIFIER
UNIT: mm
5.0
75
65
SYMBOL
T
V
V
T10XB Series (SIP)
J
R(RMS)
I
FSM
V
RRM
I
I
I
,T
o
o
R
F
stg
Mechanical Data
180
100
7.5
Case:
Terminals: Plated Leads, Solderable
Polarity: Molded on Body
per MIL-STD-202, Method 208
T10XB40
400
280
500
310
9
Molded Epoxy Resin
-40 to +150
T10XB60
900
490
10.0
1.05
11
120
600
420
2.7
10
T10XB80
800
560
Rev 0, Sep 2002
UNIT
V
V
A
A
A
V
C
A
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t10xb Summary of contents
Page 1
... Cooling Fin Single-face Area S1 (cm Cooling Fin Single-face Area S2 (cm Note: Vertical Mounting 40ºC. HS Material 1.5mm-Thick Aluminum 3.0mm-Thick Copper a Manufactured by Tianjin Zhong – Huan Semiconductor Co., Ltd. T10XB Series (SIP) 10-AMPERE SILICON BRIDGE RECTIFIER Mechanical Data Case: Terminals: Plated Leads, Solderable per MIL-STD-202, Method 208 ...
Page 2
... If the devices are to be encapsulated, they should be cleaned and dried at 120º ± 5ºC for at least 24 hours prior to encapsulation. Test for compatibility between the device package and the encapsulation material. T10XB Series (SIP) 0.8 0 ...